Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CCTC TCC1206X7R103K501DTS
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- CCTC TCC1206X7R103K501DTS
- Type
- CCTC
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC1206X7R103K501DTS
- Electronic Component
- 1
- Electronic Component
- 10nF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.045g
- Electronic Component
- 1
- Electronic Component
- BM0265115656
- Electronic Component
- X7R
- Voltage
- 500V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC1206X7R103K501DTS 产品概述
一、产品简介
TCC1206X7R103K501DTS 为 CCTC（三环）系列贴片多层陶瓷电容（MLCC），封装为 1206（3216英制），标称电容 10nF（103），额定电压 500V，容差 ±10%（K），介质等级 X7R，厚度约 0.85mm。产品注明“抗断裂”，适合对机械应力与焊接应力有较高可靠性要求的应用场景。
二、主要参数
- 容值：10nF（103）
- 容差：±10%（K）
- 额定电压：500V DC
- 介质：X7R（温度特性：-55℃～+125℃ 工作范围内容值变化受控）
- 封装：1206（尺寸及厚度适配面装工艺，厚度约 0.85mm）
- 特性：抗断裂结构设计，提高热机械应力耐受能力
三、产品特性与优势
- 高压等级：500V 额定电压适用于高压滤波、耦合与缓冲场合。
- 稳定性：X7R 介质在宽温区间内保持相对稳定的电容特性，适合一般旁路与去耦用途。
- 机械可靠性：标注“抗断裂”，通常通过改良电极与端电极结构或施加抗裂涂层来降低焊接或挠曲导致的裂纹风险，提升良率与长期可靠性。
- 标准贴片：1206 尺寸利于自动贴装与后续回流焊接，厚度 0.85mm 对布局高度和封装兼容性有利。
四、典型应用
- 高压电源输入滤波与稳压器耦合
- 开关电源、DC-DC 转换器的高压侧旁路与谐振电路
- 工业控制、测量仪器、医疗设备中对高压隔离或高压旁路的需求场景
- 高频去耦与 EMI 抑制（需结合电路频段评估容抗）
五、焊接与使用建议
- 建议遵循无铅回流焊工艺规范，参考器件供应商的回流温度曲线；避免长时间高温暴露以减小机械应力。
- PCB 设计时尽量避免在电容两端或附近留有会导致板弯曲的切割/槽口，减小焊后或使用中因板弯引发的应力集中。
- 焊盘设计需保证充分的焊脚湿润与焊接强度，但避免过大焊膏量造成器件浮起或热应力异常。
- 对关键可靠性场合建议进行拉伸/热循环/振动验证。
六、选型与存储建议
- 选型时确认工作电压裕量与温度下的容值变化是否满足电路要求；X7R 为非精密温度系数介质，若需高精度或低温漂应考虑 NP0/C0G 等介质。
- 储存应避免潮湿、高温、强光直射，按照行业湿敏等级（MSL）处理，开盘后尽快使用或回封干燥保存。
总结：TCC1206X7R103K501DTS 为一款面向高压应用的 1206 X7R MLCC，兼顾电气性能与机械可靠性，适合工业与仪器类高压旁路、滤波与去耦场景。选用与安装时请参照厂方数据手册与工艺规范以获得最佳可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
