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CBI(创基) MMBT3904
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CBI MMBT3904
- Type
- CBI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CBI
- Electronic Component
- MMBT3904
- Electronic Component
- 1
- Package
- SOT23
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.036g
- Electronic Component
- 1
- Electronic Component
- BM0228586161
- Transistor Type
- NPN
- Frequency(f T)
- 300MHz
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Collector Current(Ic)
- 200mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMBT3904 产品概述
MMBT3904 是一款通用小信号 NPN 晶体管，适用于开关与低功率放大场合。本型号由 CBI（创基）提供，SOT-23 封装，单只包装，适合表面贴装工艺与紧凑 PCB 布局。
一、主要参数
- 晶体管类型：NPN
- 集电极电流 (Ic)：200 mA
- 集—射极击穿电压 (Vceo)：40 V
- 耗散功率 (Pd)：200 mW（封装功耗限制）
- 直流电流增益 (hFE)：300 @ Ic=10 mA, Vce=1 V（高增益特性）
- 特征频率 (fT)：300 MHz（高频性能良好）
- 集电极截止电流 (Icbo)：100 nA（低泄漏）
- 集—射极饱和电压 VCE(sat)：约 300 mV @ Ic=50 mA, Ib=5 mA（低饱和压）
- 射极—基极击穿电压 (Vebo)：6 V
- 封装：SOT-23
- 数量：1 个（单管）
二、主要特性
- 高 hFE：在中小电流区具有较高放大倍数，便于简化偏置电路。
- 宽频响：fT 达 300 MHz，适合较高开关速率与射频前端小信号放大。
- 低漏电流：Icbo 仅 100 nA，有利于高阻输入或低静态电流电路的稳定性。
- 低饱和压：在开关应用中导通损耗小，提升效率。
- SOT-23 小封装：适合自动贴装、空间受限设计与大批量生产。
三、典型应用
- 通用开关：驱动小继电器、LED、光耦等低功率负载。
- 小信号放大器：前置或中频级放大、音频增益级。
- 高速脉冲电路：基于其较高 fT，用于脉冲驱动与数字接口缓冲。
- 电平转换与偏置电路：利用高 hFE 实现小电流放大与偏置稳态。
四、设计与使用要点
- 功率与热管理：单颗 Pd 为 200 mW，须在设计时注意封装与 PCB 的散热，避免长期在额定耗散附近工作。
- 电流与电压边界：工作电流不宜超过 200 mA，且 Vce 不超过 40 V；请为开关场合留足裕量。
- 基极保护：Vebo = 6 V，应避免将基—射极正向过压，必要时加限流或钳位元件。
- 偏置与稳定：高 hFE 易受温度与工艺差异影响，关键电路建议加负反馈或 emitter 偏置电阻以稳定工作点。
- PCB 布局：SOT-23 及高速特性提示应缩短走线、减小寄生电感与电容，必要时加减振或旁路电容。
五、封装与采购信息
- 品牌：CBI（创基）
- 封装形式：SOT-23（表面贴装）
- 描述类别：未分类（通用小信号晶体管）
- 单位包装：1 个/件（根据供应商可选多种卷带或管装规格）
总结：MMBT3904（CBI）是一款性能均衡的 NPN 小信号晶体管，适合需求中等电流、较高增益与较好频率响应的各类电子设计。设计时应重点考虑功耗、散热与基极保护，以保证长期可靠性。
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