WMSIC Electronic Components

Chilisin LVF303015-2R2M-N LVF303015

ModelLVF303015-2R2M-N
PackageSMD
Brandchilisin
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
chilisin LVF303015-2R2M-N
Type
SMD
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CHILISIN
Electronic Component
LVF303015-2R2M-N
Electronic Component
1
Package
SMD
Type
Magnetic Display Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.063g
Inductor
2.2uH
Electronic Component
1
Electronic Component
BM0264576579
Current
1.8A
Resistor(DCR)
117mΩ
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LVF303015-2R2M-N 产品概述

一、概述

LVF303015-2R2M-N 为奇力新(chilisin)推出的一款磁胶屏蔽功率电感,额定电感值为 2.2 μH,公差 ±20%,采用表面贴装(SMD)封装,外形尺寸 3.0 × 3.0 mm,适用于高密度电源模块与开关稳压器的电磁能量储存与滤波。该器件针对点载(point-of-load)与中低功率降压转换器优化,兼顾较高直流电流能力与较低直流电阻特性。

二、主要参数

  • 电感值:2.2 μH ±20%
  • 额定电流(Irated):1.8 A(连续工作推荐值)
  • 饱和电流(Isat):2.07 A(磁芯开始显著降磁时的参考值)
  • 直流电阻(DCR):117 mΩ
  • 类型:磁胶屏蔽电感(shielded, molded)
  • 封装:SMD,尺寸 3 × 3 mm
  • 品牌:chilisin(奇力新)

三、特性与优势

  • 屏蔽结构:有效抑制漏磁与对周围元件的干扰,利于高密度布局。
  • 紧凑体积:3×3 mm 小型化封装,适合空间受限的移动设备和模块化电源。
  • 良好电流承载能力:1.8 A 额定电流满足多数中低功率开关电源需求,饱和电流 2.07 A 提供短时峰值裕量。
  • 稳定性:磁胶材料与封装工艺提供良好的机械可靠性与温度稳定性。

四、典型应用

  • 降压(Buck)DC-DC 转换器、隔离/非隔离电源模块
  • 移动终端、物联网设备、电池管理与充电电路
  • 点载转换器与电源滤波网络
  • 工控与通信设备的局部去耦与 EMI 滤波

五、设计与布局建议

  • 预留足够铜箔宽度与过孔,以降低寄生电阻和提高散热;DCR 较高时应注意压降与发热管理。
  • 对电流进行适度降额设计,长期工作建议以额定电流的 70%~80% 为目标以延长寿命并降低温升。
  • 靠近开关管与整流二极管放置,以缩短高频回流路径并降低 EMI。
  • 遵循奇力新数据手册的回流焊温度曲线与焊盘尺寸推荐,确保焊接可靠性。

六、可靠性与选型提示

在最终选型时建议参考厂商完整数据手册,确认频率响应曲线、直流偏置下的电感衰减、温升曲线与焊接工艺规范。对关键应用建议进行实际板级验证包括热测、寿命测试与电磁兼容测试,确保符合系统性能与可靠性要求。

如需更详细的电气特性曲线、尺寸图与封装信息,请索取 chilisin 官方数据手册或联系供应商获取样片与应用支持。

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