WMSIC Electronic Components

Chipanalog CA-IS3760LW

ModelCA-IS3760LW
PackageSOIC-16-300mil
BrandChipanalog
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Chipanalog CA-IS3760LW
Type
CHIPANALOG
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CHIPANALOG
Electronic Component
CA-IS3760LW
Electronic Component
1
Package
SOIC-16-300mil
Electronic Component
Isolated
Electronic Component
0.55g
Electronic Component
1
CMTI(kV/us)
100kV/us
Features
Output
Electronic Component
BM0227776252
Operating Temperature
40℃~+125℃
Output
Level
Channel Count
0
Channel Count
6
(tpd)
8ns

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CA-IS3760LW 六通道标准数字隔离器 — 产品概述

一、器件简介

CA-IS3760LW(品牌:Chipanalog / 川土微)是一款六通道单向数字隔离器,面向需要高可靠电气隔离和抗干扰能力的低速至中速数字信号隔离应用。器件采用SOIC-16-300mil封装,提供单边六路(正向6,反向0)的数字隔离通道,输出默认电平为低,适配多种主从控制与信号传输场合。

二、关键参数(概览)

  • 通道数:正向通道6,反向通道0(单向传输)
  • 最大数据速率:150 Mbps(单通道)
  • 默认输出:低电平(POWER-DOWN或未上电时输出为低)
  • 隔离电压(Vrms):5000 V(隔离安全等级参考)
  • 共模瞬态抗扰度(CMTI):100 kV/µs
  • 工作温度:-40 ℃ ~ +125 ℃
  • 工作电压:VCCA / VCCB = 2.375 V ~ 5.5 V(兼容2.5V、3.3V及5V逻辑)
  • 传播延迟(tpd):约 8 ns
  • 封装:SOIC-16-300mil

三、主要特性与设计要点

  • 高抗扰能力:100 kV/µs 的 CMTI 指标,适合电机驱动、逆变器及高 dv/dt 环境,可有效抑制共模突变引起的数据错误。
  • 强隔离性能:5000 Vrms 隔离电压,满足多种工业隔离需求,提升系统安全性与人员保护。
  • 宽电压兼容:双侧供电范围从 2.375 V 到 5.5 V,可直接与 2.5V/3.3V/5V MCU 或外设接口对接,降低电平移位需求。
  • 低延迟高速传输:约 8 ns 的传播延迟及 150 Mbps 的数据速率,支持 SPI、UART、并行控制线、PWM 与其他高速数字信号隔离。
  • 上电默认状态:若隔离侧任一电源未上电,输出为低,便于系统定义安全复位行为,但在多电源系统设计时需注意电源顺序与上电特性。

四、典型应用场景

  • 工业控制与自动化:PLC 与现场设备之间的数字信号隔离,传感器/执行器控制信号隔离。
  • 电力电子与驱动:逆变器、变频器、伺服驱动中逻辑控制与功率模块之间的隔离通信。
  • 医疗与测量设备:敏感信号与主控系统隔离以保证病人安全与测量精度(需参照具体医疗认证)。
  • 通用通信接口隔离:隔离 UART/SPI/TTL 信号,消除地环路与共模噪声影响。

五、工程使用建议

  • 电源与去耦:在 VCCA 与 VCCB 每侧近端放置 0.1 µF 陶瓷去耦电容,必要时并联 1 µF 以改善低频稳定性,避免长布线导致的电源抖动。
  • PCB 布局:保持隔离沟槽或加大爬电距离与空隙,A/B 两侧地线分别处理并通过指定方式连接;尽量避免高速信号跨越隔离边界。
  • 信号完整性:对高速通道加上合适匹配/缓冲,若驱动长线或大电容负载,需评估上升/下降时间与总线终端。
  • 功能验证:注意默认输出低的行为对系统上电、掉电与异常恢复的影响;在需要双向通信的场合,可通过组合器件或配置对向通道实现。
  • 散热与封装:SOIC-16-300mil 封装适合通用 PCB 安装,保证周围通风并检查热源邻近布局以维持器件工作温度在规格范围内。

六、优势总结

CA-IS3760LW 提供高隔离电压、优异 CMTI 与兼容宽电压的特性,结合低传播延迟与 150 Mbps 的传输能力,适合工业与电力电子等高电磁干扰环境的数字隔离需求。器件体积适中、接口友好,是替代传统光耦、满足中高速隔离场景的可靠选择。

如需进一步的电气规格表、引脚排列图或参考电路图,可向 Chipanalog(川土微)索取完整数据手册以开展详细硬件设计与验证。

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