WMSIC Electronic Components

Chipanalog CA-IS3082CWX

ModelCA-IS3082CWX
PackageSOIC-16-WB
BrandChipanalog
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Chipanalog CA-IS3082CWX
Type
CHIPANALOG
Minimum package
1000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CHIPANALOG
Electronic Component
CA-IS3082CWX
Electronic Component
1
Package
SOIC-16-WB
Electronic Component
Isolated RS485 / 422Transceiver
Electronic Component
0.863g
Electronic Component
256
Electronic Component
1
CMTI(kV/us)
150kV/us
Features
Bus
Electronic Component
BM0230898459
Operating Temperature
40℃~+125℃
Receiver
1
Communication
Electronic Component
Electronic Component
±20kV

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CA-IS3082CWX 产品概述

一、概述

CA-IS3082CWX 是川土微(Chipanalog)推出的一款隔离型差分半双工收发器,适用于多节点工业总线与现场总线接口场合。器件集成 1 路驱动器与 1 路接收器,支持多达 256 节点网络,最大数据速率可达 500 kbps,逻辑侧和总线侧工作电压均为 3.0 V 至 5.5 V,工作温度范围覆盖 -40 ℃ 至 +125 ℃。器件采用 SOIC-16-WB 封装,便于标准 PCB 组装与散热设计。

二、关键性能

  • 最大数据速率:500 kbps,满足多种工业通信协议速率需求。
  • 通讯模式:半双工(half-duplex),适配 RS-485/RS-485-like 总线拓扑。
  • 隔离电压(Vrms):5000 V,有效隔离高共模干扰与地回路风险。
  • 共模瞬变抑制速率(CMTI):150 kV/µs,保障在强电磁干扰场景下的通信可靠性。
  • 节点支持:最多 256 节点,适合大规模分布式测控系统。

三、保护与可靠性设计

  • 静电保护:器件对 IO 管脚支持 ±20 kV(人体模式) ESD 抗扰性,提升现场可装配与维护时的可靠性。
  • 失效保护电路:在输出短路或故障状态下提供保护,减少因单点故障导致的系统级连锁影响。
  • 总线故障检测:内置故障检测机制,便于上层 MCU 或监控逻辑快速识别总线异常并采取保护或重试策略。
  • 宽工作温度范围(-40 ℃ 至 +125 ℃),满足工业级温度和长期可靠性要求。

四、应用场景

  • 工业现场总线与楼宇自控:如 MODBUS、Profibus 等半双工总线接口。
  • PLC、远程 IO、采集模块:用于多节点采集与控制场景,支持集中式或分布式拓扑。
  • 电机驱动与伺服系统:在强电磁干扰环境下提供可靠通信隔离。
  • 能源与智能电网设备:逆变器、配电自动化等需要高隔离与高 CMTI 的应用。

五、封装与布局建议

  • 封装:SOIC-16-WB,兼顾引脚密度与散热。
  • PCB 布局要点:保持隔离区的爬电间距与对流气隙,逻辑侧和总线侧采用独立电源地平面并通过一处滤波/隔离连接。关键信号线短且成对走线,差分对匹配阻抗以减小反射。
  • 电源去耦:在逻辑侧和总线侧各自近端放置 0.1 µF 与 1 µF 去耦电容,必要时增加磁珠或共模滤波器以提高 EMI 抑制。
  • 保护器件:在总线入口建议并联 TVS 或浪涌保护器件以及限流器件,配合器件内置故障保护提升系统鲁棒性。

六、选型与注意事项

选择 CA-IS3082CWX 时应确认系统需求是否需 5000 Vrms 隔离与 150 kV/µs CMTI 能力;如系统存在更高速率或全双工要求,则需评估其他器件。器件在高温或强EMI环境下表现优异,但仍建议在 PCB 设计与现场接线时严格遵守隔离与接地规范,以保证长期可靠性。

如需原理图参考、电气特性曲线或封装尺寸图,可联系川土微(Chipanalog)获取详细数据手册与应用笔记。

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