WMSIC Electronic Components

Chipanalog CA-IS3621LW

ModelCA-IS3621LW
PackageSOIC-16-300mil
BrandChipanalog
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Chipanalog CA-IS3621LW
Type
CHIPANALOG
Minimum package
1000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CHIPANALOG
Electronic Component
CA-IS3621LW
Electronic Component
1
Package
SOIC-16-300mil
Electronic Component
Isolated
Electronic Component
0.525g
Electronic Component
1
CMTI(kV/us)
150kV/us
Features
Output
Electronic Component
BM0228291417
Operating Temperature
40℃~+125℃
Output
Level
Channel Count
1
Channel Count
1
Data
100Mbps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CA-IS3621LW 产品概述

一、产品简介

CA-IS3621LW 是川土微(Chipanalog)推出的一款高抗扰、高隔离的双向隔离器件,集成隔离电源输出,适用于工业控制、通信接口和测量系统中需要电气隔离与高速数据传输的场景。器件提供 1 路正向通道与 1 路反向通道,默认输出为低电平(失效安全),最大数据速率可达 100 Mbps,满足常见串行与并行数字总线的带宽需求。

二、主要特性

  • 最大数据速率:100 Mbps,适合高速数字信号隔离。
  • 通道数:正向通道 1 路,反向通道 1 路,支持双向通信链路设计。
  • 隔离耐压:5000 Vrms,提供工业级强化隔离能力。
  • 共模抗扰度(CMTI):150 kV/µs,针对强干扰环境保证信号完整性。
  • 集成隔离电源:器件内置隔离电源,可输出 5V 或 3.3V(用户选型或连接方式决定),集成电源工作电压范围 3.0V~5.5V。
  • 失效状态:默认输出为低电平,提高系统安全性与确定性。
  • 工作温度范围:-40℃ 至 +125℃,适合工业温度等级应用。
  • 封装:SOIC-16,300 mil,便于标准 PCB 工艺与波峰/回流焊装配。
  • 品牌:Chipanalog(川土微)。

三、典型应用

  • 工业现场总线隔离(传感器与控制器之间的数字隔离)。
  • 电力与能源采集系统中高速数据链路隔离。
  • 医疗器械与测试测量设备(需高压隔离的数字接口)。
  • 电机驱动与逆变器控制回路的控制信号隔离。
  • 需要统一隔离电源输出的嵌入式隔离模块。

四、设计要点与建议

  • 电源管理:为保证隔离电源稳定,建议在器件集成电源输出端并联低 ESR 电容(按数据手册推荐值)并靠近器件引脚布置。
  • 接地与走线:严格区分输入侧与输出侧接地,避免桥接两侧地;高速信号线应缩短、并避免与强干扰源并行,以发挥 150 kV/µs 的 CMTI 优势。
  • 隔离间距:在 PCB 布局时,保证满足所需爬电距离与气隙,配合 5000 Vrms 的隔离等级满足系统安全要求。
  • 失效与上电顺序:器件缺省输出为低电平,有助于系统上电与故障时的确定性行为;上电/掉电顺序应参考系统需求,避免在电源切换时产生不可预期的信号瞬变。
  • 热管理:虽然工作温度范围宽,长时间高温或高频工作仍需注意良好散热与周边器件的热影响。

五、封装、可靠性与采购

  • 封装形式:SOIC-16-300mil,便于常见 SMT 工艺装配与测试。
  • 可靠性:5000 Vrms 隔离、-40℃~+125℃ 的工业级温度范围和高 CMTI 指标,适合严苛工业环境。
  • 采购与替代:品牌为 Chipanalog(川土微),建议在采购时确认封装、出货测试与数据手册一致,必要时与供应商确认隔离电源输出的具体接线/选择方式。

如需进一步的原理框图、典型应用电路或 PCB 布局示例,可提供具体系统要求(工作电压、接口类型与拓扑),以便给出更详细的设计建议。

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