WMSIC Electronic Components

CRMICRO CS4N65A4R

ModelCS4N65A4R
PackageTO-252-2
BrandCRMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CRMICRO CS4N65A4R
Type
CRMICRO
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CRMICRO
Electronic Component
CS4N65A4R
Electronic Component
1
Package
TO-252-2
Type
N
Electronic Component
MOSFET
Electronic Component
0.511g
Electronic Component
1
Electronic Component
BM0264355094
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
75W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
650V
Capacitor(Ciss)
610pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CS4N65A4R 产品概述

一、主要参数

CS4N65A4R 是华润微(CRMICRO)推出的一款 650V 额定耐压、N 沟道功率 MOSFET。主要电气参数为:最大漏源电压 Vdss = 650V,连续漏极电流 Id = 4A,导通电阻 RDS(on) = 2.8Ω(VGS = 10V),耗散功率 Pd = 75W,阈值电压 VGS(th) = 4V。栅极总电荷 Qg = 14.5nC(以 10V 驱动评定),输入电容 Ciss = 610pF,输出电容 Coss = 53pF,反向传输电容 Crss = 3.5pF。工作结温范围为 -55℃ 至 +150℃,封装为 TO-252-2(常见 DPAK 形式)。

二、主要特性

  • 高电压耐受性:650V 的 Vdss 使其适合高压开关场合,如离线开关电源和功率因数校正(PFC)级。
  • 面向开关的电容/电荷特性:Ciss = 610pF 与 Qg = 14.5nC 的组合表明在中等频率下有良好开关性能,但需要合适的驱动能力以控制开关损耗。
  • 机械与温度可靠性:-55℃ 至 +150℃ 的工作温度范围适应苛刻环境,TO-252-2 封装兼顾散热与表面贴装工艺。

三、典型应用场景

  • 开关电源(SMPS)高压开关管
  • 功率因数校正(PFC)前端级
  • 高压 DC-DC 转换器与反激/正激拓扑
  • 需要 600V 以上阻隔的工业/家电驱动电路
    由于 RDS(on) 较高(2.8Ω@10V),CS4N65A4R 更适合中小功率、高压但非低损耗导通主回路场合,或作为高侧/低占空比开关器件。

四、使用与选型建议

  • 驱动电压:器件的 RDS(on) 给出是在 VGS = 10V 条件下,阈值 VGS(th)≈4V,属于非逻辑电平类型,建议使用能输出接近 10V 的栅极驱动器以保证低阻导通;若采用较低驱动电压,导通损耗会显著增加。
  • 栅极驱动能力:Qg = 14.5nC,要求驱动器具备相应的瞬态电流能力以实现迅速开关,此外可并联合适的栅阻以抑制振铃并控制 dv/dt。
  • 开关损耗与电容影响:Coss 与 Crss 会影响开关过渡过程中的能量交换与米勒效应,设计时需考虑缓冲电路或 RC 缓冲以减小过冲与 EMI。
  • 热管理:额定 Pd = 75W 为理想条件下的耗散,实际电路中需根据铜箔面积、散热片或 PCB 散热路径做热仿真与功率退载,确保结温在安全范围内。

五、封装与散热

TO-252-2(DPAK)为表面贴装封装,适合自动化贴装与回流焊工艺。该封装在中小功率场合提供经济可靠的散热路径,必要时可通过加大 PCB 铜箔热沉、采用散热垫或外置散热器来提升热性能,保证长期可靠性。

六、总结

CS4N65A4R 是一款面向高压开关应用的 N 沟 MOSFET,具有 650V 耐压和中等导通电阻特性,适合离线电源、高压变换和 PFC 等场合。选用时应重视栅极驱动(10V 驱动为佳)、栅极电荷对驱动器的要求以及散热设计,结合具体拓扑与频率做综合评估,以获得最佳性能与可靠性。

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