WMSIC Electronic Components

CRMICRO CRSD082N10L2

ModelCRSD082N10L2
PackageTO-252
BrandCRMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CRMICRO CRSD082N10L2
Type
CRMICRO
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CRMICRO
Electronic Component
CRSD082N10L2
Electronic Component
1
Package
TO-252
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.438g
Electronic Component
1
Electronic Component
BM0226507706
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
101W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
100V
Capacitor(Ciss)
2.626nF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CRSD082N10L2 产品概述

一、产品简介

CRSD082N10L2 是华润微(CRMICRO)推出的一款高性能 N 沟道场效应管(MOSFET),单只(数量:1 个),适用于中高压功率开关场合。器件限定工作温度范围为 -55℃ 到 +150℃,封装为常见的 TO-252(DPAK),便于表面贴装与散热处理。

二、主要电气参数

  • 漏源电压 Vdss:100 V
  • 连续漏极电流 Id:78 A
  • 导通电阻 RDS(on):7.2 mΩ @ Vgs=10 V, Id=78 A
  • 栅极阈值电压 Vgs(th):1.4 V(典型)
  • 栅极总电荷 Qg:44.5 nC @ Vgs=10 V
  • 输入电容 Ciss:2.626 nF @ 50 V
  • 反向传输电容 Crss:38 pF @ 50 V
  • 功率耗散 Pd:101 W
  • 工作温度范围:-55℃ ~ +150℃

三、性能特点

  • 低导通阻抗:7.2 mΩ 的低 RDS(on) 在 10 V 驱动下能够显著降低导通损耗,适合高电流应用。
  • 宽电压和电流能力:100 V 的耐压配合 78 A 的连续电流能力,适用于较高电压轨与大电流负载。
  • 中等栅极电荷:Qg=44.5 nC 表明需要合理的栅极驱动能力以实现快速开关,否则开关损耗和开通/关断时间将受限。
  • 电容特性:Ciss 与 Crss 数据有助于评估开关瞬态与米勒效应对电路的影响,便于驱动与 EMI 设计。

四、典型应用场景

  • DC-DC 升降压变换器与同步整流器
  • 开关电源(SMPS)主开关或同步 MOSFET
  • 电机驱动与逆变器前端开关
  • 电池管理与供电保护电路(需按具体认证要求评估)
  • 工业电源与通信设备的功率级

五、使用建议与注意事项

  • 推荐栅极驱动电压:为达到标称 RDS(on),建议采用 10 V 驱动。若使用逻辑电平驱动需验证实际导通损耗。
  • 栅极驱动设计:由于 Qg 较大,推荐使用具备足够电流能力的驱动器,并在栅极并联适当阻尼电阻以控制振铃与 EMI。
  • 热管理:Pd 标称 101 W 表明器件热耗散依赖良好的散热路径;在 TO-252 封装下应优化 PCB 散热铜箔、过孔或外接散热片以避免过热并保证长期可靠性。
  • 布局建议:最小化漏-源回流路径的寄生电感,优化电流回路,靠近电源和地进行去耦,注意米勒电容导致的开关瞬态。
  • ESD 与可靠性:按工业静电防护规范处理,存储与焊接遵循厂商建议的回流曲线与防潮等级。

六、封装与订购信息

封装:TO-252(DPAK),便于表面贴装与中等功率散热。型号:CRSD082N10L2,品牌:CRMICRO(华润微)。单件包装数量为 1 个,订购时请根据实际需求确认包装形式与出货规格。

七、总结

CRSD082N10L2 是一款在 100 V/78 A 级别具有低导通阻抗和良好热能力的 N 沟道 MOSFET,适合要求较高电流与较高开关性能的功率电路。合理的栅极驱动与热设计是发挥其优越性与确保可靠性的关键。若需用于特殊应用(如汽车等级或高频高温环境),建议结合完整数据手册与可靠性测试结果进一步确认。

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