WMSIC Electronic Components

DIOTEC ZMY30

ModelZMY30
PackageDO-213AB
BrandDIOTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DIOTEC ZMY30
Type
DIOTEC
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DIOTEC
Electronic Component
ZMY30
Electronic Component
1
Package
DO-213AB
Electronic Component
Zener Diode
Electronic Component
0.17g
Electronic Component
1
(Zzt)
8Ω
Electronic Component
BM0228561117
Diode
1
Current(Ir)
1uA@14V
Power Dissipation(Pd)
1.3W
Electronic Component
28V~32V
Electronic Component
50℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ZMY30 稳压二极管产品概述

一、产品简介

ZMY30 是 DIOTEC(德欧泰克)推出的一款30V标称稳压二极管,封装为 DO-213AB。该器件设计用于作稳压基准和稳压保护,具有低反向漏电、高稳压精度以及良好的热稳定性,适合多种电源管理与保护场景。

二、主要电气参数

  • 稳压值(标称):30V,允许范围28V~32V,可满足中高压稳压需求。
  • 反向电流 Ir:1 μA @ 14V,漏电流极小,有利于提高静态功耗性能和系统精度。
  • 阻抗 Zzt:8 Ω(动态阻抗),代表在规定测试电流下的等效交流阻抗,阻抗较低,负载变化时稳压性能良好。
  • 耗散功率 Pd:1.3W,为器件最大允许耗散功率,须结合热设计进行使用。

三、热性能与可靠性

工作结温范围为 -50 ℃ 至 +150 ℃,能够在宽温度范围内保持性能稳定。需要注意的是 1.3W 的耗散功率通常基于理想散热条件给出,实际电路中应考虑散热路径与环境温度,对功耗进行适当降额。例如在不良散热情况下应限制流经二极管的电流,以避免结温超过允许范围影响寿命。

四、使用与计算建议

作为并联稳压元件时,可用公式 Imax ≈ Pd / Vz 估算理论最大电流:1.3W / 30V ≈ 43 mA。但实际应用中建议留有余量(典型建议 50%~75% 降额),并配合限流电阻或恒流源使用,保证长期可靠性。动态阻抗 8 Ω 表明当负载电流发生变化时,伏特变动量约为 ΔV ≈ Zzt × ΔI,应据此评估输出纹波与稳压精度。

五、封装与装配

DO-213AB 为轴向引线封装,适合通孔焊接和波峰/手工焊接工艺。在焊接时建议控制焊接温度与时间,避免对器件本体造成过热;存储和装配过程中应注意防潮防静电,保证焊点机械与电气连接可靠。

六、典型应用场景

  • 基准稳压:为模拟与数字电路提供稳定参考电压。
  • 过压/浪涌保护:在电源瞬态情况下作为钳位元件,保护后级电路。
  • 通用电源模块:用于小功率电源的二级稳压或分压补偿。

七、选型与注意事项

选择 ZMY30 时应核实系统最大允许电流、环境温度及散热条件;若负载电流较大或环境温度高,建议选用功耗更高或带散热片的替代型号。使用中需关注工作电压是否长期处于稳压二极管的高应力区,并留意反向漏电对低功耗电路的影响。

如需更详细的电气特性曲线、测试条件或封装图纸,可参考厂商数据手册以完成最终设计确认。

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