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DIOTEC ES3D
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DIOTEC ES3D
- Type
- DIOTEC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DIOTEC
- Electronic Component
- ES3D
- Electronic Component
- 1
- Package
- DO-214AB(SMC)
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.356g
- Electronic Component
- 1
- Electronic Component
- BM0228685090
- Current
- 3A
- Current(Ir)
- 5uA@200V
- (Vf)
- 900mV@3A
- Electronic Component
- 50℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 200V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ES3D 产品概述
一、产品简介
ES3D 是 DIOTEC（德欧泰克）推出的一款快恢复、高效率整流二极管，采用 DO-214AB（SMC）封装，针对中高功率开关电源与功率整流场合优化设计。器件在3A工况下正向压降仅约900mV，兼具较低导通损耗与短反向恢复时间，适合需要提高效率与降低热耗的电源设计。
二、主要电气参数（典型值）
- 正向压降 Vf：900mV @ 3A
- 额定直流反向耐压 Vr：200V
- 连续整流电流 If：3A
- 反向电流 Ir：5μA @ 200V
- 反向恢复时间 Trr：20ns
- 非重复峰值浪涌电流 Ifsm：125A（单次浪涌）
- 工作结温范围 Tj：-50℃ ~ +150℃（器件允许范围）
- 封装：DO-214AB（SMC）
- 品牌：DIOTEC（德欧泰克）
三、主要特性与优势
- 快速恢复：Trr≈20ns，能有效降低开关损耗与开关应力，适用于高开关频率的SMPS和电子变压设备。
- 低正向压降：在3A工作点约0.9V，降低导通损耗，有助于提高整机效率并减小散热需求。
- 低反向漏电：200V时反向漏电仅约5μA，利于高压侧的泄漏控制与静态损耗降低。
- 强抗浪涌能力：Ifsm=125A，可承受短时启动或故障时的浪涌冲击。
- 宽工作温度：-50℃~+150℃结温范围，适应性强，可靠性高。
四、典型应用场景
- 开关电源（SMPS）次级整流与同步替代器件
- 功率因数校正电路（PFC）与高频整流
- 逆变器与电机驱动的自由轮二极管
- LED 驱动电源、充电器、适配器及UPS系统
- 需要兼顾效率与耐压、并且要求短反向恢复的电力电子场合
五、使用建议与可靠性注意事项
- 热管理：尽管封装DO-214AB功率容载能力较强，仍建议在PCB上增加散热铜箔面积或使用热扩散层，确保器件在额定电流下有良好散热路径。
- 浪涌与过电流：Ifsm为单次非重复峰值，设计中需避免重复超额冲击；必要时在输入端加入浪涌吸收或限流保护。
- 反向恢复与EMI：快恢复特性虽有利于损耗，但在开关边沿处可能产生较高的电压尖峰和EMI，必要时配合RC吸收、缓冲网络或软开关措施。
- 焊接与组装：按照制造商推荐的回流焊工艺与温度曲线进行焊接，避免超温影响器件寿命。存储与装配时注意防潮与静电防护。
- 选型留量：在长期和高温工况下建议按额定值留有裕量，考虑温度对导通损耗与漏电增加的影响。
ES3D 在中高压、高频电源与整流应用中能够在效率、热耗与耐压之间提供良好平衡，是追求高效率与可靠性的工程设计中常用的整流器件选择。若需要更详细的封装尺寸、热阻或可靠性实验数据，请参照 DIOTEC 官方数据手册。
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