WMSIC Electronic Components

DIOTEC SUF4007

ModelSUF4007
PackageDO-213AB
BrandDIOTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DIOTEC SUF4007
Type
DIOTEC
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DIOTEC
Electronic Component
SUF4007
Electronic Component
1
Package
DO-213AB
Electronic Component
Switch Diode
Electronic Component
0.168g
Electronic Component
1
Electronic Component
BM0227699847
Current
10A
Diode
Electronic Component
Current(Ir)
5uA@1000V
(Vf)
1.7V@1A
Electronic Component
50℃~+175℃@(Tj)
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SUF4007 — Ultrafast 整流二极管(DIOTEC,DO-213AB)

一、产品概述

SUF4007 为 DIOTEC(德欧泰克)出品的超快整流二极管,采用 DO-213AB(MELF)封装,结构为独立式器件。器件设计用于高电压、快速切换场合,额定反向耐压高达 1000V,正向工作电流以 1A 典型额定值为基准,同时在特定脉冲/冲击条件下可承受更高瞬态电流。其快速恢复特性与低反向漏电使之在开关电源和工业电源中具有良好性能表现。

二、主要特性

  • 反向耐压(Vr):1000V,适用于高压整流与保护。
  • 正向压降(Vf):约 1.7V @ 1A,兼顾导通损耗与稳态热耗散。
  • 额定整流电流:典型工作为 1A;短时脉冲或冲击条件下可承受更高电流(原厂资料中给出峰值能力,请按应用环境评估)。
  • 反向电流(Ir):约 5 µA @ 1000V,低漏电有利于高压稳压和待机功耗控制。
  • 反向恢复时间(Trr):约 75 ns,开关转换损耗与电磁干扰(EMI)控制优于普通慢恢复整流二极管。
  • 工作结温范围:-50 ℃ 至 +175 ℃,适应宽温区工业级应用。

三、典型应用

  • 开关电源(SMPS)中的输出整流与回输续流管。
  • 高压电源与整流桥(HV charger、工控电源)。
  • 反向保护与钳位电路(高压浪涌抑制)。
  • 电机驱动与功率转换中的快速恢复需求场景。
  • 太阳能逆变器、照明驱动等需兼顾高压与高频开关的应用。

四、关键电气与热特性说明

SUF4007 在 1A 工作点的正向压降约 1.7V,意味着在中等直流负载下会产生可预见的导通损耗,布局时应考虑热量分散。反向恢复时间 75 ns 表明器件在开关过程中回收电荷快速,有助于降低开关损耗与振铃,但在大电流突变场合仍需配合适当的阻尼或 RC 吸收网络以抑制尖峰。高压下的反向漏电(5 µA @ 1000V)虽低,但长期高压工作时需关注温升与漏电随温度上升的变化。

五、封装与可靠性提示

DO-213AB (MELF) 玻璃封装提供优良的环境密封性与电气稳定性,但在手工装配时需注意 MELF 封装的轴向形状与流片焊接工艺差异:推荐采用回流焊或波峰焊兼容的工艺曲线并遵循制造商的焊接温度与时间限值。器件具有宽温范围与工业级耐热特性,但在高结温或频繁热循环的应用中,应保证良好散热和合适的热阻管理。

六、选型与使用建议

在选型时,优先核对实际工作电压留有足够裕量(建议反向工作电压远低于 1000V 极限以提高可靠性)。若电路存在较大瞬态电流或浪涌,需检查器件峰值承受能力并配合熔断保护或限流设计。对高频开关场合,SUF4007 的 75 ns 恢复时间能显著降低开关损耗,若对恢复更快的性能有需求,可对比更低 Trr 的快恢复或肖特基方案以平衡正向压降与开关损耗。

如需进一步寄送样品或获取完整数据手册(含浪涌能力曲线、热阻、典型电气特性曲线与焊接规范),建议联系 DIOTEC 官方或授权代理以获取最准确的应用与可靠性数据。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.