WMSIC Electronic Components

EVERLIGHT EL817S1(C)(TU)-FG EL817S1

ModelEL817S1(C)(TU)-FG
PackageSMD-4P
BrandEVERLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EVERLIGHT EL817S1(C)(TU)-FG
Type
EVERLIGHT
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
EVERLIGHT
Electronic Component
EL817S1(C)(TU)-FG
Electronic Component
1
Package
SMD-4P
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.426g
Electronic Component
1
Electronic Component
18us
Electronic Component
BM0258764216
Operating Temperature
55℃~+110℃
Load Voltage
35V
Type
DC
Output Current
50mA
Output Type
Photoelectric Transistor
(Pd)
200mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EL817S1(C)(TU)-FG 产品概述

一、主要特点

EL817S1(C)(TU)-FG 为 EVERLIGHT(台湾亿光)出品的一款直流驱动、光电三极管输出型光耦合器。器件采用 SMD-4P 表面贴装封装,单通道设计,强调输入与输出间的高电隔离与经济型信号隔离解决方案。其显著特点包括高隔离电压、较宽的CTR 范围以及适用于低速数字/模拟隔离的响应时间。

二、主要规格参数

  • 输入类型:DC(发光二极管)
  • 输出类型:光电三极管(NPN 型)
  • 正向压降 Vf(典型):1.2 V
  • 正向电流 If(最大):60 mA(资料标注)
  • 输出电流 IC(最大):50 mA
  • 隔离电压 Vrms:5 kV
  • 负载电压(VCE 最大):35 V
  • 集电极-发射极饱和电压 VCE(sat):约 0.2 V(资料中标注“200 mV @ 20 mA, 1 mA”,通常指在指定 IF/IC 条件下测得)
  • 电流传输比 CTR:最小 50%,最大/饱和值 600%
  • 上升/下降时间 tr/ tf:18 μs / 18 μs(典型)
  • 总功耗 Pd:200 mW
  • 输出通道数:1
  • 工作温度:资料标注为 55℃+110℃,该项常见为 -55℃+110℃,建议在采购或设计前与供应商确认具体温度范围

三、典型应用场景

  • MCU 与工业控制电路间的信号隔离
  • 开关电源及电源反馈回路隔离
  • 家电与办公设备的低速数字隔离
  • 继电器/驱动器输入隔离、传感器信号隔离
  • 通讯接口、PLC 输入通道等需要高共模抑制但速度要求不高的场合

四、设计与使用建议

  • 输入侧:根据 Vf ≈ 1.2 V 计算限流电阻。例如在 5 V 驱动下,若希望 If = 1 mA,则 R ≈ (5 − 1.2) / 1 mA ≈ 3.8 kΩ;若采用较大驱动电流以求更高 CTR,可按功耗和 If 上限(60 mA)谨慎选择。
  • 输出侧:注意 VCE 不超过 35 V 且总功耗 Pd ≤ 200 mW。若外接负载需保证 IC ≤ 50 mA,并考虑 VCE(sat) 在饱和时的电压降。
  • 速度特性:tr/tf ≈ 18 μs,适合低速或中低速数字信号隔离,不适用于高速通信接口(如高速 UART、SPI、USB 等)。
  • CTR 波动大:器件 CTR 范围宽(50%–600%),输出饱和电流受 If、温度及制造批次影响,系统设计时应考虑最小 CTR 条件下的可靠驱动裕量,必要时做预留放大或反馈。
  • PCB 布局:保持输入与输出地电位分离,尽量增加爬电距离与对板上隔离槽(slot)留白以提升实测隔离性能;按厂商推荐的焊盘与过孔方案布板。

五、封装与采购信息

  • 封装形式:SMD-4P(表面贴装,4 引脚单通道)
  • 品牌/制造商:EVERLIGHT(台湾亿光)
  • 型号:EL817S1(C)(TU)-FG
  • 适用于批量 SMT 贴装生产,可配合常见回流焊工艺。但在采用前请参考厂商完整数据手册确认封装尺寸、焊盘推荐与回流曲线。

六、可靠性与注意事项

  • 隔离电压 5 kVrms 提供较好的瞬态防护,但实际系统安全等级还需结合爬电距离、工频耐压测试与系统环境评估。
  • 建议在高温或高湿环境下进行可靠性验证;同时对资料中“工作温度”项与厂方确认,避免因温度范围误读导致设计失效。
  • CTR 随温度与长期老化可能下降,关键应用建议进行寿命和温漂测试。

如需我为您整理基于此器件的典型驱动电路(含元件计算示例)或对比同类替代器件,请告知您的供电电压、目标输出电流及信号速度要求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.