WMSIC Electronic Components

EVERLIGHT EL817S1(C)(TU)-VG EL817S1

ModelEL817S1(C)(TU)-VG
PackageSMD-4P
BrandEVERLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EVERLIGHT EL817S1(C)(TU)-VG
Type
EVERLIGHT
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
EVERLIGHT
Electronic Component
EL817S1(C)(TU)-VG
Electronic Component
1
Package
SMD-4P
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.45g
Electronic Component
1
Electronic Component
18us
Electronic Component
BM0231130233
Operating Temperature
55℃~+110℃
Load Voltage
35V
Type
DC
Output Current
50mA
Output Type
Photoelectric Transistor
(Pd)
200mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EL817S1(C)(TU)-VG 产品概述

一、概述

EL817S1(C)(TU)-VG 是 EVERLIGHT(台湾亿光)推出的一款晶体管输出光电耦合器,采用 SMD-4P 封装,单通道设计。器件以高隔离电压、较大输出电流与宽工作温度范围为特点,适用于开关信号隔离、逻辑接口以及电源反馈等常见隔离场景。

二、主要参数(典型/限值)

  • 输入类型:DC(发光二极管)
  • 正向压降 Vf:1.2 V(典型)
  • 正向电流 If(最大):60 mA
  • 输出类型:光电三极管(晶体管输出)
  • 输出电流 Iout(最大):50 mA
  • 集-射极饱和电压 VCE(sat):100 mV(测试条件:If=20 mA, IC≈1 mA)
  • 隔离耐压 Vrms:5 kV
  • 直流反向耐压 Vr(LED):9 V
  • 负载电压(最大):35 V
  • 上升/下降时间 tr/tf:约 18 μs / 18 μs
  • 电流传输比 CTR:最小 50%,最大/饱和值 600%
  • 总功耗 Pd:200 mW
  • 工作温度范围:-55 ℃ ~ +110 ℃
  • 输出通道数:1

三、封装与机械信息

  • 封装:SMD-4P(表面贴装,四引脚)
  • 优势:小型化、适合自动贴片;便于高密度 PCB 布局与 SMT 生产流程。
  • 布局建议:保持输入与输出之间的爬电/爬距,遵守 5 kV 隔离要求的 PCB 走线间距与灌封工艺规范。

四、典型应用场景

  • 开关电源(SMPS)和电源反馈隔离
  • 工业控制接口与 PLC 隔离
  • 微控制器到高电压电路的信号隔离
  • 电信与仪器仪表的接口防护

五、设计注意事项与实用建议

  • 驱动 LED 时根据目标 If 计算限流电阻:R_LED = (Vdrive - Vf) / If。若 Vdrive=5V,目标 If=10 mA,则 R ≈ (5-1.2)/0.01 ≈ 380 Ω。
  • 输出侧为开集电极结构,需外接上拉电阻。上拉电阻选择需保证 IC ≤ 50 mA 且在 VCE(sat) 条件下满足逻辑电平。示例:Vcc=5V,目标 IC=10 mA,Rpull-up ≈ (5V - VCE(sat)) / 10 mA ≈ 490 Ω。
  • CTR 受温度与 If 影响大,设计时应预留裕量以应对 CTR 变化(最低 50%)。
  • 高频响应受器件本身 tr/tf 限制(约 18 μs),不适用于高频高速隔离场合;若需要更快响应,请选择高速光耦或光电隔离器。
  • 热耗散与功率限制:芯片总功耗 Pd=200 mW,长时间高 If 应考虑热设计与散热,避免超出封装热极限。
  • 输出最大负载电压 35 V,设计中避免超过该值以保证器件可靠性。

六、可靠性与测试

  • 器件支持 5 kV rms 隔离耐压测试,适合需要高电压隔离的应用。建议在最终产品中进行系统级绝缘与爬电距离验证。
  • 在极端温度(-55 ℃ 到 +110 ℃)下仍能工作,但 CTR 与速率会随温度变化,需做温度系数评估。

总结:EL817S1(C)(TU)-VG 以其高隔离等级、较大输出电流与紧凑 SMD 封装,适合工业与消费类产品中常见的信号隔离与接口保护应用。在实际设计中注意 LED 驱动、上拉设计、热管理与 CTR 变化,即可发挥该器件的稳定性能与可靠性。

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