WMSIC Electronic Components

EVERLIGHT EL827S1(TA) EL827S1

ModelEL827S1(TA)
PackageSOP-8-2.54mm
BrandEVERLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
EVERLIGHT EL827S1(TA)
Type
EVERLIGHT
Unit
Electronic Component
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
EVERLIGHT
Electronic Component
EL827S1(TA)
Electronic Component
1
Package
SOP-8-2.54mm
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.854g
Electronic Component
1
Electronic Component
4us
Electronic Component
BM0227655360
Operating Temperature
55℃~+110℃
Load Voltage
80V
Type
DC
Output Current
50mA
Output Type
Photoelectric Transistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EL827S1(TA) 产品概述

一、产品简介

EL827S1(TA) 为 EVERLIGHT(亿光)出品的一款晶体管输出光耦,输入为 DC 驱动的发光二极管,输出为光电三极管(Phototransistor)。器件以高隔离电压、宽工作温度、较大输出电流能力及简单易用的 SOP-8(2.54mm)封装为特点,适合直流信号的电气隔离与接口移位。

二、主要性能与规格

  • 输入侧(LED)
    • 正向压降 Vf ≈ 1.2V(典型)
    • 允许正向电流 If(最大)= 60mA(注意长期工作建议取更低电流以延长寿命)
    • 反向耐压 Vr = 6V
  • 输出侧(光电三极管)
    • 最大集电极电流 Ic(max) = 50mA
    • 集-射极饱和电压 VCE(sat) 典型值 100mV(条件:If=20mA, Ic=1mA,按给定条件标注)
    • 负载电压(耐压)VCBO/ VCEO 可达 80V(用于选择负载与耐压等级)
    • 电流传输比(CTR)范围:最小 50%,最大/饱和值可达 600%(取决于 If 与测试条件)
  • 隔离与可靠性
    • 隔离电压 Vrms = 5kV(用于高压隔离设计评估)
    • 工作温度范围:-55℃ ~ +110℃
  • 动态性能
    • 上升时间 tr ≈ 3µs,下降时间 tf ≈ 4µs(适合中低速信号隔离,非高速逻辑隔离器)

三、封装与引脚

  • 封装:SOP-8,针距 2.54mm,适合通用 PCB 布局与自动贴装工艺
  • 引脚排列符合常见光耦管脚定义(使用前请参考官方封装图确认 VCC、GND、Anode/Cathode、Collector/Emitter 的具体引脚)

四、典型应用与设计注意事项

  • 典型应用场景
    • MCU 与高压侧或噪声电路的直流信号隔离
    • 开关电源反馈、欠压/过压检测
    • 工业控制、继电器驱动信号隔离、传感器接口
  • 设计建议与计算示例
    • CTR 波动较大,设计时以最小 CTR(≥50%)做保守估计。例如需 Ic=2mA,则 If 最少 ≈ 4mA(2mA / 0.5)。
    • 若在 5V 逻辑侧使用,欲在低电平饱和 Ic≈1mA(VCE(sat)≈0.1V),上拉电阻 R ≈ (5V-0.1V)/1mA ≈ 4.9kΩ。
    • 为保证寿命与热稳定,若非必要不建议长期使用 If 接近 60mA 的极限,应优先在 5–20mA 范围内选取工作电流,并留足安全裕量。
    • 由于 VCE(sat) 与 CTR 会随温度、If、老化而变化,关键控制信号请增加裕量或使用判定阈容错设计。

五、热管理与可靠性注意

  • SOP-8 封装散热有限,若输出频繁工作在大电流(接近 50mA)或 If 较高时,应考虑 PCB 散热、铜箔面积扩展或限制占空比。
  • 长期在高温(接近 110℃)或高湿环境应评估 CTR 下降与漂移,对安全隔离场合应按照系统标准做额外寿命与高压击穿测试。

六、快速选型提示

  • 需要中等速度、直流信号隔离且要求较高隔离电压(5kV)时,EL827S1(TA) 为合适选择。
  • 若对响应速度有严格要求(亚微秒级),建议选用高速型光耦或数字光隔离器;若需更大输出电流或更稳定的逻辑接口,可考虑带有达林顿或晶体管阵列的替代器件。

总结:EL827S1(TA) 提供了可靠的直流信号隔离能力、较高的隔离电压与较大输出电流承载能力,适用于工业与消费电子中多数隔离场合。实际设计时应基于 CTR 最小值、VCE(sat) 条件与热管理做保守计算,以保证系统稳定性与长期可靠性。

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