Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
X1G0059610002
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- EPSON X1G0059610002
- Type
- EPSON
- Minimum package
- 2000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- EPSON
- Electronic Component
- X1G0059610002
- Electronic Component
- 1
- Package
- SMD3225-4P
- Electronic Component
- Active Crystal Oscillator
- Electronic Component
- 0.05g
- Frequency
- 25MHz
- Electronic Component
- 1
- Electronic Component
- BM0265376894
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 1.62V~3.63V
- Operating Current
- 2.2mA
- Electronic Component
- ±50ppm
- Output
- CMOS
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
EPSON X1G0059610002 有源CMOS晶振产品概述
一、核心规格参数总览
EPSON X1G0059610002是一款工业级有源CMOS晶振，核心参数清晰适配多场景需求：
- 基础频率：25MHz（主流基准频率，兼容多数MCU、SoC的时钟输入）；
- 频率精度：常温±50ppm（满足工业控制、消费电子的时序精度要求）；
- 输出模式：CMOS（与TTL/CMOS逻辑电平兼容，驱动能力强）；
- 工作电压：1.62V~3.63V（覆盖低功耗电池（1.8V）和标准3.3V供电）；
- 工作电流：典型2.2mA（低功耗设计，延长便携设备续航）；
- 温度范围：-40℃~+85℃（工业级适应性，应对高低温环境）；
- 封装形式：SMD3225-4P（3.2×2.5mm贴片，4引脚，适合小型化PCB）；
- 品牌：EPSON（爱普生，全球晶振领域知名品牌，以高精度可靠性著称）。
二、电气性能关键特性
- CMOS输出兼容性：输出电平直接匹配MCU、FPGA、通信芯片等数字电路，无需额外缓冲器或匹配电阻，简化电路设计；
- 宽电压覆盖：1.62V至3.63V的电压范围，既支持智能穿戴的1.8V低功耗供电，也兼容工业设备的3.3V标准电源；
- 低功耗运行：仅2.2mA的典型工作电流，在蓝牙耳机、智能手环等电池设备中可有效降低功耗，延长续航；
- 稳定频差控制：常温±50ppm的精度，在温度波动范围内仍能保持时序稳定，避免通信丢包、数据处理错误等问题。
三、封装与可靠性设计
- 小型化封装：SMD3225-4P尺寸仅3.2×2.5mm（厚度约0.8mm），适配高密度PCB布局，满足便携设备的空间限制；
- 工业级温度可靠性：-40℃~+85℃的工作范围，可应对户外温差、工业车间高温等场景，无需额外散热设计；
- 有源晶振优势：内置振荡电路，无需外部晶体匹配，相比无源晶振抗干扰能力更强，时序稳定性更高。
四、典型应用场景
X1G0059610002凭借多维度性能优势，广泛覆盖以下领域：
- 消费电子：智能手环、蓝牙耳机、便携式音箱（小封装+低功耗）；
- 工业控制：PLC、传感器节点、工业物联网网关（宽温+稳定频差）；
- 通信设备：小型无线路由器、蓝牙模块、LoRa终端（CMOS输出兼容通信芯片）；
- 车载辅助设备：部分车载蓝牙、胎压监测（适配-40℃~+85℃的环境需求）。
五、产品优势总结
该晶振的核心竞争力在于：
- 品牌背书：EPSON多年市场验证，精度和可靠性有保障；
- 场景适配性：宽电压、宽温、小封装组合，覆盖消费、工业、通信等多领域；
- 设计简化：CMOS输出无需缓冲，有源晶振无需外部匹配，降低PCB设计难度；
- 成本平衡：工业级性能与合理成本结合，适合批量应用。
综上，X1G0059610002是一款兼顾精度、可靠性与成本的有源晶振，可满足多数中端设备的时序需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
