Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
爱普生(EPSON)X1G0041710027是一款16MHz CMOS输出有源晶振,采用SMD2520-4P小型表面贴装封装,专为对频率稳定性、低功耗及宽环境适应性有要求的电子设备设计,覆盖工业控制、嵌入式系统、消费电子等多领域应用。
X1G0041710027定位于工业级兼容的通用有源晶振,核心优势体现在以下三点:
X1G0041710027采用SMD2520-4P封装(尺寸:2.5mm×2.0mm×0.8mm),是小型化表面贴装封装,适合高密度PCB设计。引脚定义如下(参考EPSON同类产品标准):
引脚编号 功能 说明 1 VCC 电源输入(1.62V~3.63V) 2 GND 接地 3 OUT 时钟输出(CMOS电平) 4 NC 空脚(无功能,可悬空)封装特点:
X1G0041710027的参数特性使其适用于多领域:
爱普生X1G0041710027有源晶振凭借16MHz稳定频率、宽电压兼容、低功耗、宽温适应性及小型SMD2520封装,成为多领域电子设备的高性价比时钟源选择。其EPSON品牌的工艺可靠性,进一步保障了产品在长期使用中的稳定性,适合对成本、性能及可靠性均有要求的应用场景。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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