WMSIC Electronic Components

Q13FC13500004

ModelQ13FC13500004
PackageSMD3215-2P
BrandEPSON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EPSON Q13FC13500004
Type
EPSON
Minimum package
3000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
EPSON
Electronic Component
Q13FC13500004
Electronic Component
1
Package
SMD3215-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.001g
Frequency
32.768kHz
Electronic Component
1
Electronic Component
BM0264864907
Operating Temperature
40℃~+85℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12.5pF
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Q13FC13500004无源贴片晶振产品概述

Q13FC13500004是爱普生(EPSON)推出的工业级无源32.768kHz贴片晶振,专为需要稳定计时基准、低功耗且适应宽温度范围的电子设备设计。该产品采用SMD3215-2P小型贴片封装,核心参数匹配实时时钟(RTC)、物联网节点等主流应用需求,是工业控制、消费电子、车载周边等领域的常用计时组件。

一、关键参数详解

该晶振的核心参数明确,可直接支撑电路设计与选型判断:

  • 频率精度:标称频率32.768kHz(RTC领域标准基准频率,与二进制计时逻辑兼容),常温(25℃)频差±20ppm——满足日常计时(如秒级精度)、低速率通信的频率稳定性要求;
  • 负载电容:12.5pF(无源晶振需匹配外部负载电容,设计时需结合PCB寄生电容计算并联电容值,确保总负载电容为12.5pF);
  • 等效串联电阻(ESR):70kΩ(反映晶振内部损耗,该值处于无源晶振常规范围,需注意电路驱动能力与ESR的匹配,避免起振困难);
  • 工作温度范围:-40℃~+85℃(覆盖工业级温度场景,可适应户外设备、车载环境等高低温工况);
  • 封装形式:SMD3215-2P(2引脚贴片封装,尺寸约3.2mm×1.5mm×0.8mm,体积小巧,适合高密度PCB布局)。

二、核心性能优势

  1. 宽温稳定性:-40℃~+85℃的工作温度范围,可满足工业现场(如户外传感器、PLC)、车载辅助系统等对温度适应性要求较高的场景,避免高低温下频率漂移导致的计时误差;
  2. 低功耗设计:无源晶振本身无内置驱动电路,功耗极低,适配电池供电的物联网节点、智能穿戴设备等低功耗需求;
  3. 品牌可靠性:爱普生作为晶振领域老牌厂商,Q13FC13500004采用成熟的石英晶体工艺,长期稳定性好,可减少设备售后维护成本;
  4. 兼容性强:32.768kHz是全球通用的RTC基准频率,可直接匹配单片机(如STM32、ATmega系列)内置RTC模块,或独立RTC芯片(如DS3231),无需额外频率转换。

三、典型应用领域

该晶振的参数与封装特性,使其广泛应用于以下场景:

  1. 实时时钟(RTC)系统:单片机内置RTC、独立RTC模块(如智能电表、工业记录仪的时间同步);
  2. 物联网(IoT)节点:低功耗传感器(如温湿度传感器、智能门锁)的定时唤醒、数据上报计时;
  3. 消费电子:智能手表、手环的时间显示与同步,蓝牙耳机的低功耗计时;
  4. 工业控制:PLC、远程IO模块的定时任务调度,工业传感器的采样间隔控制;
  5. 车载电子:车载显示屏的时间显示,车载辅助系统(如胎压监测)的定时数据传输。

四、选型与使用注意事项

为确保晶振正常工作,需注意以下要点:

  1. 负载电容匹配:无源晶振需外部并联负载电容,计算公式为( C_L = \frac{C_1 \times C_2}{C_1 + C_2} + C_{stray} )(( C_{stray} )为PCB寄生电容,通常1~2pF),需调整( C_1 )、( C_2 )使总( C_L=12.5pF );
  2. 驱动能力验证:ESR70kΩ需确认电路驱动电流(如单片机晶振引脚的驱动能力)是否满足起振要求(一般要求驱动电流≥( \frac{V_{CC}}{ESR} ),需参考芯片 datasheet);
  3. 焊接工艺规范:贴片封装需采用回流焊,峰值温度建议240~250℃,时间不超过10秒,避免过热导致晶体性能下降;
  4. 静电防护:石英晶振对静电敏感,焊接、存储过程需采取ESD防护措施(如防静电工作台、离子风扇)。

Q13FC1350004凭借稳定的频率性能、宽温适应性与小型化封装,成为多领域计时基准的优选组件,可满足大多数常规电子设备的计时需求。

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