Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
该产品为风华电子(FH)推出的高频叠层贴片电感,型号VHF060303HQ3N0ST02,针对射频、高频电路的小体积、低损耗需求设计,采用0201小型化封装,电感值3nH,是便携式电子设备射频前端的常用基础元件。其叠层陶瓷工艺兼顾高频性能与批量一致性,适配对空间、功耗敏感的无线通信场景。
注:电感值偏差符合工业标准(±5%),实际参数需以风华官方规格书为准。
高频特性突出
针对500MHz左右的VHF/UHF频段优化,Q值达14(同封装同电感值中偏优水平);自谐振频率7.5GHz远高于典型应用频段,避免高频下电感特性突变,保障射频信号的相位与幅度稳定性。
小封装高集成度
0201封装为目前贴片电感最小规格之一,体积仅约0.05mm³,适配智能手机、智能穿戴等对空间要求严苛的设备,可有效压缩PCB布局面积,助力终端产品轻薄化。
低损耗与一致性
叠层陶瓷工艺实现低DCR(≤200mΩ),减少直流功率损耗;批量生产一致性好,电感值偏差控制在±5%内,适合大规模量产的射频模块,降低电路调试复杂度。
环保与可靠性
符合RoHS、REACH等环保标准,采用高温烧结工艺,耐焊接热冲击(回流焊温度260℃以上可稳定通过);工作温度范围-40℃~+85℃,长期可靠性满足工业级要求。
该产品因高频性能、小体积优势,广泛应用于以下场景:
风华VHF060303HQ3N0ST02是一款专为高频小功率电路设计的小型化叠层电感,兼具低损耗、高Q值、小体积等优势,适配便携式电子设备的射频模块需求,是射频工程师选型时的高性价比选择。实际应用中需结合具体电路的频率、电流、空间要求,参考官方规格书确认参数匹配性。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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