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FOJAN FRC0603F4701TS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOJAN FRC0603F4701TS
- Type
- FOJAN
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- FOJAN
- Electronic Component
- FRC0603F4701TS
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.023g
- Electronic Component
- 4.7kΩ
- Electronic Component
- 1
- Electronic Component
- BM0261485624
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC0603F4701TS — FOJAN 富捷 0603 贴片厚膜电阻 产品概述
一、产品概述
FRC0603F4701TS 是 FOJAN（富捷）推出的一款 0603 封装贴片厚膜电阻，阻值 4.7kΩ，精度 ±1%，额定功率 100mW。该器件面向空间受限且对温漂、精度有一定要求的消费电子、工业控制与通信终端等应用场景，兼具成本效益与可靠性，适合大批量表面贴装生产。
二、主要技术参数
- 电阻类型：厚膜（Thick Film）贴片电阻
- 阻值：4.7kΩ（4701）
- 精度：±1%（F）
- 额定功率：100mW
- 最大工作电压：75V
- 温度系数（TCR）：±100ppm/℃
- 工作温度范围：-55℃ ~ +155℃
- 封装：0603（1.6mm × 0.8mm，公制常规尺寸）
- 标称型号：FRC0603F4701TS，品牌：FOJAN（富捷）
三、结构与材料特点
采用厚膜印制工艺制成，基体材料与导电浆料通过烧结形成稳定的电阻膜层。0603 小型化封装支持高密度贴装，端电极采用可焊金属化处理以保证良好的焊接性能与可靠的电气连接。厚膜工艺在成本与批量一致性方面具有优势。
四、电气性能与可靠性
该电阻在常温下额定功率为 100mW，具有 ±1% 的阻值精度及 ±100ppm/℃ 的温度系数，保证中等温漂性能及较高的阻值稳定性。工作温度范围宽（-55℃ 至 +155℃），适应工业级温度环境。厚膜电阻耐潮湿、机械应力和常见回流焊工艺，满足常规环境可靠性要求。
五、典型应用场景
- 移动与便携式设备的低功耗电路
- 模拟信号分压、偏置与限流场合
- 工业控制模块、传感器前端电路
- 通信设备、消费电子的通用去耦与电阻网络
六、封装与安装建议
推荐采用标准贴片回流焊工艺，遵循厂家或 PCB 制造商的热回流曲线以避免过高峰值温度和过长加热时间；贴装时注意焊盘尺寸与锡膏印刷的一致性以保证焊点质量。由于功率受限，在高温或高散热条件下需考虑功率降额与散热设计。
七、选型与注意事项
在选型时需确认最大工作电压 75V 是否满足电路需求，并考虑温度系数对电路精度的影响；若在高精度或高功率场景，可考虑更高功率或薄膜/金属膜电阻替代。批量采购时建议确认包装形式（卷带/盘带）与出货检验报告以满足生产需求。
若需样品资料、详细尺寸图或可靠性测试报告，可联系 FOJAN 富捷供应渠道获取更完整的技术支持与数据手册。
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