WMSIC Electronic Components

FOJAN FRC0402F1303TS

ModelFRC0402F1303TS
Package0402
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0402F1303TS
Type
FOJAN
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0402F1303TS
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.01g
Electronic Component
130kΩ
Electronic Component
10
Electronic Component
BM0264525312
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0402F1303TS 厚膜贴片电阻产品概述

一、产品核心定位与基础属性

FRC0402F1303TS是富捷电子(FOJAN)推出的小功率高精度厚膜贴片电阻,采用0402(英制封装代码,对应公制1005尺寸)封装,专为高密度、低功耗电子电路设计。该产品核心参数明确:阻值130kΩ(对应阻值代码1303)、精度±1%、额定功率62.5mW、工作电压50V,兼顾尺寸小型化与电气性能稳定性,适配消费电子、工业控制等多领域的低信号电路需求。

二、关键技术参数深度解析

  1. 阻值与精度:130kΩ标称阻值搭配±1%高精度等级,满足信号放大、分压电路等场景对电阻值的准确控制需求,避免因阻值偏差导致的信号失真或功能异常;
  2. 功率与电压承载:62.5mW额定功率、50V工作电压,适配小信号、低功耗场景(如传感器前端调理、微控制器外围电路),可稳定承载电路负载无过载风险;
  3. 温度稳定性:±100ppm/℃温度系数,即温度每变化1℃,阻值变化不超过0.01%,宽温环境下仍保持参数一致性,减少环境温度对电路性能的影响;
  4. 宽温工作范围:-55℃~+155℃区间覆盖极端低温(户外低温)与高温(设备内部散热区),满足工业、汽车等领域的环境适应性要求。

三、封装与工艺特性

1. 0402封装优势

0402封装尺寸(约1.0mm×0.5mm)极小,可显著降低PCB空间占用,适合智能手机、可穿戴设备等对尺寸严苛的终端产品;同时支持高密度SMT贴装,提升生产效率。

2. 厚膜工艺特点

采用厚膜电阻工艺(丝网印刷电阻浆料+高温烧结),具备以下优势:

  • 成本可控:适合大规模批量生产,性价比高于薄膜电阻;
  • 稳定性佳:厚膜层耐机械应力、抗潮湿,长期使用阻值漂移小;
  • 工艺兼容:适配常规SMT回流焊、波峰焊,无特殊制程要求。

四、典型应用场景

FRC0402F1303TS的参数特性适配多类低功耗、高密度电路:

  1. 消费电子:智能手机/平板的信号滤波、传感器接口电路(加速度计、环境光传感器);
  2. 可穿戴设备:智能手环/手表的低功耗电源管理、心率传感器调理电路;
  3. 工业控制:小型PLC输入输出模块、PT100温度传感器信号放大电路;
  4. 汽车电子:车载中控小信号处理、胎压监测(TPMS)辅助电阻;
  5. 通信设备:小型基站/路由器的射频信号调理、电源滤波电路。

五、可靠性与环境适应性

  1. 环境耐受性:厚膜工艺赋予抗潮湿、抗盐雾性能,符合RoHS环保标准,可在恶劣环境下长期稳定工作;
  2. 焊接可靠性:封装适配SMT回流焊,焊接后无虚焊、脱落风险,满足电子制造良率要求;
  3. 长期稳定性:经老化测试后阻值漂移控制在极小范围,适合对参数一致性要求高的产品。

六、品牌与质量保障

富捷电子(FOJAN)是国内专业贴片电阻制造商,产品通过ISO9001认证;FRC0402F1303TS批量一致性好,供货周期稳定,适配OEM/ODM厂商大规模生产需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.