Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC0805F1001TS是富捷(FOJAN)推出的一款0805封装厚膜贴片电阻,主打「高性价比+场景兼容性」,适配多数中精度需求的电子电路。核心特性可概括为:
各参数直接决定应用边界,具体意义及适用场景如下:
1kΩ(编码1001)±1%
1kΩ是电子电路中最常用的阻值之一(如信号分压、上拉/下拉电阻),±1%精度可覆盖非精密测量类电路(如传感器信号调理、电源滤波),无需为0.1%级高精度支付额外成本。
125mW(即1/8W)
由公式(I=\sqrt{P/R})计算,最大允许电流约11.18mA,适配小电流应用(如LED指示限流、MCU接口电阻)。需注意:实际功率需降额至额定值的80%以内(环境温度>100℃时),避免过热失效。
150V
覆盖多数低压电路(12V/24V工业电源、5V消费电子),无需额外串联防护电阻,降低电路复杂度。
±100ppm/℃
表示阻值随温度的变化率:每升高1℃,阻值变化±100万分之一。例如:温度从25℃升至125℃(变化100℃),阻值变化±0.1%,满足一般环境下的稳定性需求。
-55℃+155℃
超出常规工业级(-40℃85℃)标准,可适应北方户外设备(冬季低温)、车载电子(发动机舱高温)等场景,无需特殊防护。
英制尺寸:0.08英寸×0.05英寸(公制:2.0mm×1.2mm),体积小巧,可节省PCB空间(适合智能手机、智能手环等便携式设备);兼容主流贴片机,贴装效率高,适合批量生产。
采用「丝网印刷+高温烧结」工艺,相比薄膜电阻:
因参数均衡、成本可控,该电阻广泛应用于:
富捷(FOJAN)作为国内厚膜电阻专业制造商,该产品具备:
该产品凭借「均衡参数+高性价比」,成为中低端电子电路的优选电阻之一。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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