WMSIC Electronic Components

FOJAN FRC0402F1332TS

ModelFRC0402F1332TS
Package0402
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0402F1332TS
Type
FOJAN
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0402F1332TS
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.01g
Electronic Component
13.3kΩ
Electronic Component
10
Electronic Component
BM0264520720
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0204F1332TS 厚膜贴片电阻产品概述

一、产品核心定位

FRC0204F1332TS是富捷(FOJAN)品牌推出的一款小功率高精度厚膜贴片电阻,采用行业通用的0402封装(英制尺寸约1.0mm×0.5mm),主打“小体积、宽温域、成本平衡”的实用特性,主要面向消费电子、工业控制、小型医疗设备等领域的信号调理、限流分压等基础电路设计。

二、关键参数与性能解读

该产品的核心参数围绕“实用场景适配”展开,具体如下:

1. 阻值与精度

阻值为13.3kΩ(四位代码“1332”对应:前三位有效数133,第四位倍率10²,即133×10²=13300Ω),精度±1%——意味着实际阻值波动范围在13.167kΩ~13.433kΩ之间,能满足大部分“无需极致精度”的电路需求(如传感器信号放大、微控制器I/O接口限流)。

2. 功率与电压

  • 额定功率62.5mW(0.0625W):适配低功耗电路,避免大电流下的过热风险;
  • 最大工作电压50V:结合功率计算,最大允许电流为1.25mA(62.5mW÷50V),电路设计时需注意电流不超限。

3. 温度稳定性

  • 温度系数**±100ppm/℃**:每变化1℃,阻值变化百万分之一百(如100℃温差下,13.3kΩ电阻变化约133Ω),属于“中等稳定”级别,足以应对工业级温度环境;
  • 工作温度范围**-55℃~+155℃**:覆盖户外、车载等恶劣温度场景,符合工业设备的宽温要求。

4. 封装与工艺

采用0402贴片封装,适合自动化贴装,能大幅节省PCB空间;工艺为厚膜电阻——相比薄膜电阻成本更低,且性能稳定,适合大规模量产。

三、典型适用场景

结合参数特性,该电阻主要应用于以下场景:

1. 消费电子便携设备

智能手机、智能手表的传感器信号调理电路(如压力传感器分压、心率模块限流),小封装适配设备轻薄化需求,低功耗延长电池续航。

2. 工业控制模块

PLC(可编程逻辑控制器)的I/O接口、小型温度采集模块,宽温范围(-55~+155℃)能适应车间、户外等复杂环境。

3. 小型医疗设备

便携式血糖仪、血压计的信号放大电路,±1%精度满足基础测量需求,0402封装适配设备小型化设计。

4. 汽车辅助系统

车载显示屏背光控制、车载传感器(如胎压监测)的信号处理电路,宽温特性适配车载高低温环境(需确认是否符合汽车级认证要求)。

四、选型注意事项

设计时需关注以下要点,避免误用:

  1. 功率匹配:电路实际电流不得超过1.25mA(或根据电压计算:电流≤62.5mW÷工作电压),否则易导致电阻过热损坏;
  2. 精度升级需求:若需更高精度(如0.1%),需替换为薄膜电阻(如金属膜、金属箔电阻);
  3. 温度极限:若工作环境温度超出-55℃~+155℃(如高温炉内),需选择高温电阻(如200℃以上耐温产品);
  4. PCB兼容性:0402封装的焊盘尺寸需匹配PCB设计(通常推荐0.6mm×0.3mm左右),避免贴装不良;
  5. 认证要求:若需RoHS、REACH等环保认证,需确认富捷该型号是否满足对应标准。

五、产品优势总结

FRC0204F1332TS的核心优势在于“平衡”:

  • 成本与性能平衡:厚膜工艺降低成本,±1%精度覆盖80%以上实用场景,无需为“超需求精度”支付溢价;
  • 体积与功能平衡:0402小封装适配小型化设计,同时满足低功耗、宽温的功能需求;
  • 品牌与供货平衡:富捷作为国内成熟电阻厂商,产品供货稳定,适合批量生产。

综上,FRC0204F1332TS是一款“实用型”厚膜贴片电阻,能为消费电子、工业控制等领域的基础电路提供可靠、经济的阻值控制方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.