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FOJAN FRC0603F6801TS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOJAN FRC0603F6801TS
- Type
- FOJAN
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- FOJAN
- Electronic Component
- FRC0603F6801TS
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.023g
- Electronic Component
- 6.8kΩ
- Electronic Component
- 10
- Electronic Component
- BM0261485676
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC0603F6801TS 产品概述
一、产品简介
FRC0603F6801TS 是 FOJAN（富捷）出品的一款 0603 封装厚膜贴片电阻，阻值 6.8kΩ，精度 ±1%，额定功率 100mW，额定工作电压 75V。该元件采用厚膜工艺制备，适用于批量表贴装配线，兼容常见的无铅回流工艺，适合对尺寸、成本和可靠性有综合要求的低功耗电路。
二、主要性能参数
- 阻值：6.8kΩ（标称）
- 阻值精度：±1%（B级）
- 额定功率：100mW（室温下）
- 最大工作电压：75V
- 温度系数（TCR）：±100 ppm/℃
- 工作温度范围：-55℃ ～ +155℃
- 封装：0603（约 1608 公制尺寸，1.6 × 0.8 mm）
- 结构：厚膜电阻，表面贴装
三、产品特点与优势
- 稳定性好：厚膜工艺在常温及常见环境下具有良好的电阻稳定性和批次一致性。
- 小尺寸高密度：0603 封装有利于高密度 PCB 设计，节省空间。
- 高可靠性：适用于工业级温度范围（-55℃ 至 +155℃），耐环境应力能力强。
- 生产兼容性：适配自动贴片和回流焊流程，便于快速量产装配。
四、典型应用场景
- 消费类电子（手机配件、穿戴设备、家用电器）
- 通信设备与网络终端（阻容分压、偏置网络）
- 仪器仪表与传感器前端（滤波、阻抗匹配）
- 工业控制与低功耗电源电路
五、包装、可靠性与使用建议
- 包装形式：常见为卷带（Tape & Reel），适用于贴片机自动上料（具体包装请按订购信息确认）。
- 焊接建议：兼容无铅回流，请遵循焊膏与 PCB 工艺规范，避免超过器件承受的热应力；推荐参考锡膏供应商的回流曲线。
- 使用注意：在高温、高湿或强机械应力环境下，应考虑适当功率降额以延长寿命；存放时避免受潮和挤压，开带后尽快使用或按湿敏等级（如适用）做干燥处理。
如需样品规格书（datasheet）、可靠性试验数据（如耐湿、耐冲击、寿命试验）或大批量交期与价格信息，请提供目标采购数量与用途，我方可提供更详细的支持与建议。
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