Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FOJAN FRC0402F2003TS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOJAN FRC0402F2003TS
- Type
- FOJAN
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- FOJAN
- Electronic Component
- FRC0402F2003TS
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.01g
- Electronic Component
- 200kΩ
- Electronic Component
- 1
- Electronic Component
- BM0264521533
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC0402F2003TS 厚膜贴片电阻产品概述
一、产品基本定位
FRC0402F2003TS是富捷电子（FOJAN）推出的0402封装厚膜贴片电阻，针对小型化、高精度、宽温适应性场景设计，兼顾成本优势与性能稳定性，适用于消费电子、工业控制等多领域的标准化电路设计，是小功率电路中替代普通商业级电阻的优选方案。
二、核心电气参数详解
该电阻的关键电气性能精准匹配低功耗、高精度电路需求：
- 阻值与精度：200kΩ±1%，阻值偏差控制在1%以内，满足信号调理、分压电路、反馈网络等对阻值精度敏感的应用；
- 功率等级：62.5mW，为0402封装的典型低功耗功率等级，适配电池供电类设备（如智能穿戴、物联网终端）的能耗控制；
- 工作电压：最大连续工作电压50V，需注意电路中瞬时电压不超过此限值，避免过压击穿风险；
- 温度系数（TCR）：±100ppm/℃，表示温度每变化1℃，阻值变化百万分之一百，宽温下阻值稳定性较好（如155℃时，相比25℃基准阻值变化约1.3%，叠加原始精度后总偏差≤2.3%）。
三、封装与工艺特性
- 封装规格：0402英制封装（公制1005），尺寸约1.0mm×0.5mm×0.3mm，体积小巧，可实现PCB高密度布局，适配自动化贴装产线；
- 厚膜工艺：采用陶瓷基片+丝网印刷电阻浆料+高温烧结工艺制成，相比薄膜电阻成本降低30%以上，批量生产一致性好；相比绕线电阻体积缩小85%，完全满足贴片化生产需求。
四、环境适应性表现
- 工作温度范围：-55℃+155℃，覆盖工业级宽温需求（商业级通常为070℃），可在极端环境（如户外传感器、车载辅助电路）下稳定工作；
- 耐候性：符合RoHS 2.0、REACH等环保标准，表面镀层为无铅锡合金，具备良好的焊接可靠性（可通过回流焊、波峰焊）与抗盐雾腐蚀能力。
五、品牌与品质保障
富捷电子（FOJAN）是国内被动元件领域的成熟厂商，该产品通过多层品质管控：
- 出厂前100%阻值测试，精度一致性偏差控制在±0.5%以内（优于标称±1%）；
- 批量生产采用自动化检测线，每批次抽样检测温漂、功率稳定性等指标；
- 提供常规2年质保，支持小批量样品测试（最小起订量100pcs），适配研发与量产需求。
六、典型应用场景
- 消费电子：智能手机主板信号滤波、智能手表传感器调理电路（小体积+低功耗）；
- 工业控制：小型PLC输入模块、温度传感器放大电路（宽温适应性）；
- 物联网终端：低功耗环境监测节点、智能门锁控制电路（62.5mW功率匹配）；
- 通信设备：路由器信号偏置电路、小型基站滤波网络（高精度需求）；
- 汽车辅助电子：车载USB充电限流电路、后视镜雨量传感器（-55~155℃部分场景适用）。
该产品凭借高性价比、宽温稳定性与小体积优势，已成为消费电子、工业物联网等领域的主流贴片电阻选型之一。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
