WMSIC Electronic Components

FOJAN FRC0805F4701TS

ModelFRC0805F4701TS
Package0805
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0805F4701TS
Type
FOJAN
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0805F4701TS
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.028g
Electronic Component
4.7kΩ
Electronic Component
1
Electronic Component
BM0264520409
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0805F4701TS 厚膜贴片电阻产品概述

一、产品定位与核心属性

FRC0805F4701TS是富捷(FOJAN) 推出的通用型厚膜贴片电阻,采用0805标准封装,聚焦“高精度、小体积、宽温稳定”三大核心特性,适配消费电子、工业控制、小型家电等多领域的中低功率电路设计需求。产品兼顾成本与可靠性,是替代进口同规格电阻的高性价比选择。

二、关键参数规格

类别 具体参数 备注 阻值与精度 4.7kΩ(代码4701)±1% 满足大多数电路对阻值误差的常规要求 功率与电压 额定功率125mW(1/8W),最大工作电压150V 需注意功率与电压的匹配(P=V²/R) 温度特性 温度系数±100ppm/℃,工作温度-55℃~+155℃ 宽温范围内阻值漂移极小 封装尺寸 0805(英制:0.08"×0.05";公制:2.0mm×1.2mm) 适合高密度PCB布局

三、设计与工艺特点

  1. 厚膜工艺稳定性:采用厚膜印刷+烧结工艺,电阻膜层附着力强,抗机械应力、耐潮湿,长期使用阻值漂移率低于行业平均水平;
  2. 小体积高集成:0805封装在保证1/8W功率的前提下,缩小了30%以上的占用空间,适配智能手机、智能穿戴等紧凑型产品;
  3. 宽温适应性:-55℃+155℃的工作范围覆盖工业级(-40℃+85℃)和部分汽车电子(-40℃~+125℃)场景,无需额外降额;
  4. 环保合规:通过RoHS、REACH认证,无铅无卤,符合欧盟及国内电子产业环保标准。

四、典型应用场景

  1. 消费电子:智能手机/平板的电源管理(电池充放电控制、电压检测)、音频电路(信号分压、滤波);
  2. 小型家电:智能电饭煲、加湿器的控制板(微控制器周边电阻、显示驱动);
  3. 工业控制:小型PLC输入输出模块、传感器信号调理(温度传感器分压网络);
  4. 通信设备:路由器、交换机的电源滤波、信号衰减网络;
  5. 车载辅助电路:座椅调节、氛围灯控制单元的低功率电阻(需确认车规需求)。

五、品牌与品质保障

富捷(FOJAN)作为国内被动元器件龙头厂商,FRC0805系列电阻采用全自动化生产+100%出厂检测:

  • 每批次产品经过阻值分选(精度±0.5%以内)、功率老化(1.2倍额定功率测试)、温度循环(-55℃~+155℃循环50次);
  • 客户可获得完整的SGS环保报告、出厂检测报告,降低供应链风险。

六、选型与使用注意事项

  1. 功率降额:实际使用功率建议≤80%额定值(100mW以内),高温环境(>100℃)需降至70%以下;
  2. 焊接工艺:采用回流焊(峰值温度240~250℃,时间≤10秒)或波峰焊,避免焊接温度过高损坏膜层;
  3. 电压匹配:不要仅依赖150V上限,需计算实际工作点功率(如4.7kΩ在100V下功率≈2.13W,远超额定值);
  4. 存储条件:未使用电阻存储于-20℃~+40℃、湿度≤60%环境,避免受潮导致阻值漂移。

FRC0805F4701TS凭借稳定的性能、紧凑的体积和高性价比,成为中低端电子电路设计的主流选择,可直接替代国巨、三星等品牌同规格产品。

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