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FOJAN FRC0402F6342TS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOJAN FRC0402F6342TS
- Type
- FOJAN
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- FOJAN
- Electronic Component
- FRC0402F6342TS
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.01g
- Electronic Component
- 63.4kΩ
- Electronic Component
- 10
- Electronic Component
- BM0264900151
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC0402F6342TS 厚膜贴片电阻产品概述
一、产品基本属性
FRC0402F6342TS是FOJAN（富捷）品牌推出的一款小型化厚膜贴片电阻，型号命名逻辑清晰：
- “0402”对应英制封装尺寸（公制1005，约1.0mm×0.5mm）；
- “F”标识厚膜工艺；
- “6342”为阻值编码（直接对应63.4kΩ）；
- “TS”为产品系列标识。
该产品定位于小功率、高密度PCB设计场景，平衡了成本与性能，是电子电路中基础被动元件的典型选择。
二、核心性能参数详解
关键参数明确了产品的适用边界，具体如下：
- 阻值与精度：标称阻值63.4kΩ，精度±1%——远高于常规5%精度电阻，可满足信号分压、基准电压等对阻值一致性要求较高的电路；
- 功率与电压：额定功率62.5mW（0.0625W），对应0402封装的典型功率范围；工作电压额定值50V，使用时需确保电路电压不超过额定值，避免电阻过热或击穿；
- 温度特性：温度系数（TCR）±100ppm/℃——温度每变化1℃，阻值变化约0.01%，在工作温度范围内稳定性可控；
- 工作温度范围：-55℃~+155℃——覆盖工业级、汽车级等场景的高低温需求，适应极端环境长期工作。
三、封装与工艺特点
- 0402小型化封装：尺寸仅1.0mm×0.5mm，厚度约0.4mm，适合智能手机、智能穿戴等高密度PCB布局，有效缩小电路体积；
- 厚膜工艺优势：采用丝网印刷+高温烧结工艺，相比薄膜电阻成本更低，相比绕线电阻尺寸更小；厚膜层与陶瓷基底结合牢固，抗机械应力能力较强，批量生产一致性好，可满足大规模电子制造需求。
四、典型应用场景
基于小尺寸、宽温、精准阻值的特点，该电阻广泛应用于：
- 消费电子：智能手机、平板电脑的电源滤波、音频接口、传感器调理电路；
- 工业控制：PLC、工业传感器的信号分压、基准电路；
- 汽车电子：车载中控、仪表盘的小功率辅助电路（需确认是否符合汽车级更严格的可靠性标准）；
- 通信设备：基站、路由器的电源管理模块、射频辅助电路；
- 医疗仪器：小型家用医疗设备（血压计、血糖仪）的信号处理电路。
五、可靠性与环境适应性
该产品通过基础可靠性测试，满足以下要求：
- 温度循环：-55℃~+155℃循环测试，阻值变化率符合IEC 60115标准；
- 湿度耐受：85℃/85%RH环境下长期工作，阻值漂移可控；
- 机械可靠性：可承受回流焊、波峰焊等组装应力，无开裂或阻值突变；
- 长期稳定性：批量产品阻值一致性好，老化后阻值变化率≤0.5%（典型值），适合长期使用的电子设备。
六、总结
FRC0402F6342TS是一款性价比突出的厚膜贴片电阻，以小尺寸、精准阻值、宽温特性适配多场景需求，是消费电子、工业控制等领域基础电路设计的可靠选择。
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