WMSIC Electronic Components

FOJAN FRC0402F1004TS

ModelFRC0402F1004TS
Package0402
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0402F1004TS
Type
FOJAN
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0402F1004TS
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.01g
Electronic Component
1MΩ
Electronic Component
10
Electronic Component
BM0264524962
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0402F1004TS 贴片厚膜电阻产品概述

一、产品核心定位与品牌背景

FRC0402F1004TS是富捷电子(FOJAN)推出的0402封装贴片厚膜电阻,属于公司常规精度被动元件系列,主打小体积、高性价比、宽温稳定特性,适配中低功耗电子设备的信号调理、分压、偏置等基础电路需求。富捷电子作为国内专业被动元件制造商,其厚膜电阻产品以成熟工艺和可靠品质,广泛应用于消费电子、工业控制、汽车电子等领域。

二、关键性能参数解析

该型号核心参数明确覆盖常规应用需求:

  • 阻值与精度:标称阻值1MΩ(对应E96系列代码“1004”),精度±1%,满足多数工业与消费电子对阻值一致性的要求;
  • 功率与电压:额定功率62.5mW,最大工作电压50V,适配低功耗电路设计(实际应用需遵循功率降额原则);
  • 温度特性:温度系数(TCR)±100ppm/℃,即温度每变化10℃,阻值偏差≤0.1%;工作温度范围-55℃~+155℃,覆盖工业级宽温场景;
  • 工艺类型:采用厚膜丝网印刷工艺,兼顾成本与稳定性,抗硫化、耐潮湿性能优于部分薄膜电阻。

三、封装与物理特性

  • 封装尺寸:0402英制封装(公制1005),体积仅1.0mm×0.5mm,适配高密度PCB布局(如智能穿戴、小型传感器模块);
  • 贴装特性:表面贴装设计,兼容常规SMT回流焊工艺,焊接可靠性高,适合自动化批量生产;
  • 结构特点:厚膜电阻层附着于氧化铝陶瓷基底,具有良好的热传导性,可有效分散工作时的热量。

四、典型应用场景

结合参数特性,该电阻适用于以下场景:

  1. 低功耗消费电子:智能手环、蓝牙耳机等穿戴设备的传感器信号调理、电池管理辅助电路;
  2. 工业控制:PLC输入输出模块的分压网络、温度传感器的偏置电路;
  3. 通信设备:小型路由器、无线模块的射频前端滤波辅助电阻;
  4. 汽车电子:胎压监测(TPMS)模块、车身控制单元(BCM)的低功率辅助电路(需确认具体应用的温湿度要求);
  5. 物联网终端:低功耗广域网(LPWAN)节点的信号匹配电阻。

五、可靠性与环境适应性

  • 宽温稳定性:-55℃~+155℃的工作范围,可应对工业现场的极端温度波动(如户外传感器、车载设备);
  • 抗环境干扰:厚膜工艺耐潮湿、抗硫化,适合湿度较高或含硫环境(如部分工业厂房、沿海地区设备);
  • 焊接可靠性:符合IPC-A-610标准,回流焊后焊点机械强度高,抗振动性能满足常规电子设备要求;
  • 长期稳定性:在额定条件下工作,阻值漂移率低,可保证电路长期性能一致性。

六、选型与使用注意事项

  1. 功率降额:实际工作功耗建议不超过额定功率的70%(≤43.75mW),延长产品寿命;
  2. 电压限制:避免工作电压超过50V,防止击穿损坏;
  3. 焊接规范:遵循SMT回流焊温度曲线(峰值温度245℃±5℃,时间≤10s),避免热冲击;
  4. 储存条件:未开封产品储存在温度-40℃~+60℃、湿度≤60%的环境中,开封后建议1年内使用完毕。

该型号通过了RoHS、REACH等环保认证,符合全球电子设备的环保要求,是小体积、低功耗电路设计的实用选型。

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