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FOJAN FRC0402F1213TS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOJAN FRC0402F1213TS
- Type
- FOJAN
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- FOJAN
- Electronic Component
- FRC0402F1213TS
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.01g
- Electronic Component
- 121kΩ
- Electronic Component
- 10
- Electronic Component
- BM0264900167
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC0402F1213TS 产品概述
一、产品简介
FRC0402F1213TS，来自 FOJAN（富捷）的贴片厚膜电阻，封装尺寸为 0402（约 1.0 mm × 0.5 mm）。标称阻值 121 kΩ，公差 ±1%，额定功率 62.5 mW（典型 1/16W），最大工作电压 50 V，温度系数（TCR）±100 ppm/℃，工作温度范围 -55℃ ~ +155℃。该系列为表面贴装设计，适配高速贴片与回流焊工艺。
二、主要性能特点
- 高精度：阻值公差 ±1%，适用于需要较高阻值稳定性的电路。
- 小体积低功耗：0402 小封装与 62.5 mW 功率等级，适合空间受限的便携电子设备。
- 温漂可控：TCR ±100 ppm/℃，在宽温区间内保持良好阻值稳定性。
- 宽温工作：-55℃ 至 +155℃，适应工业级温度环境需求。
- 兼容性强：厚膜结构便于大规模贴装与回流焊，机械强度与焊接可靠性表现良好。
三、典型应用场景
适用于消费电子、移动终端、可穿戴设备、仪表仪器及一般工业控制电路中的分压、偏置、滤波与参考网络等场合。对体积和成本敏感但需一定阻值精度与温漂控制的应用尤为合适。
四、封装与可靠性
0402 封装利于高密度 PCB 布局，厚膜工艺在湿热、热循环及振动等环境下具有较好稳定性。实际可靠性与寿命表现建议参照厂方完整数据手册与相关环境试验报告，以满足特殊行业认证或长期运行需求。
五、使用与选型建议
- 请严格遵循额定功率和最大工作电压，避免长期在极限条件下工作；高温环境下应考虑功率降额。
- 布线时注意散热与邻近元件热耦合，必要时选用更高功率或更低 TCR 型号。
- 对更高精度或更低温漂的场合，可比较金属膜或薄膜电阻替代方案。
- 采购与设计前建议索取 FOJAN（富捷）最新数据手册，确认尺寸公差、回流焊曲线及可靠性测试数据。
更多详细电气特性、环境试验与封装尺寸信息，请参考 FOJAN 官方资料或向销售工程师咨询。
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