WMSIC Electronic Components

FOJAN FRC0402F1822TS

ModelFRC0402F1822TS
Package0402
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0402F1822TS
Type
FOJAN
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0402F1822TS
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.01g
Electronic Component
18.2kΩ
Electronic Component
50
Electronic Component
BM0265086341
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0402F1822TS 贴片厚膜电阻产品概述

一、产品基本属性

FRC0402F1822TS是FOJAN富捷推出的一款厚膜贴片电阻,采用行业通用的0402封装(英制尺寸:0.04英寸×0.02英寸,公制约1.0mm×0.5mm),属于该品牌针对低功耗、小型化电路设计的核心电阻系列。型号中“1822”为阻值标识(三位有效数字+指数:182×10²=18200Ω=18.2kΩ),“F”代表厚膜工艺代号,整体定位为工业级及消费电子常用的精准型贴片电阻。

二、关键性能参数

该电阻核心参数严格匹配设计需求,具体如下:

  • 阻值与精度:标称阻值18.2kΩ,精度±1%(满足多数信号调理、分压电路对阻值准确性的要求);
  • 功率规格:额定功率62.5mW(0.0625W),适配电池供电的低功耗设备;
  • 工作电压:最大额定电压50V,实际应用需遵循降额原则(建议不超过40V保障长期可靠性);
  • 温度系数(TCR):±100ppm/℃,即温度每变化1℃,阻值变化±0.01%,宽温区稳定性优异;
  • 工作温度范围:-55℃至+155℃,覆盖工业级极端环境(如户外设备、高温作业场景)。

三、封装与物理特性

0402封装是目前贴片电阻中最小规格之一,物理尺寸紧凑(约1.0mm×0.5mm×0.3mm),可显著节省PCB布局空间,适配智能穿戴、小型传感器等对体积敏感的产品。厚膜工艺赋予其电阻膜层附着力优势,相比薄膜电阻更耐机械振动和环境应力,适合自动化批量贴装。

四、主要应用场景

结合参数特性,该电阻广泛应用于以下领域:

  1. 低功耗便携设备:智能手环、蓝牙耳机、智能手表等电池供电产品,低功率(62.5mW)匹配续航需求;
  2. 工业控制电路:PLC模块、传感器信号调理电路(温度、压力传感器),宽温(-55~155℃)满足工业现场极端环境;
  3. 消费电子终端:手机、平板的信号滤波、分压电路,±1%精度保障信号传输准确性;
  4. 小型医疗仪器:血糖监测仪、便携式血氧仪等,小封装适配设备微型化设计;
  5. 汽车辅助电路:发动机舱附近低功率辅助模块(如传感器接口),155℃高温耐受符合部分场景需求。

五、产品优势特点

  1. 宽温稳定性突出:±100ppm/℃的TCR及-55155℃范围,比常规工业级电阻(-40125℃)覆盖更广,极端温度下阻值漂移小;
  2. 小封装高密度:0402封装是同精度电阻最小规格,可提升PCB集成度,降低产品体积;
  3. 精准度适配主流需求:±1%精度平衡性能与成本,满足90%以上通用电路设计,无需过度追求高精度的额外成本;
  4. 厚膜工艺可靠性:厚膜烧结工艺使电阻膜层与陶瓷基底结合牢固,抗湿、抗振动性能优于薄膜电阻,长期故障率低;
  5. 品牌工艺保障:FOJAN富捷作为国内成熟制造商,产品通过RoHS、REACH认证,批量一致性好,适合量产。

六、可靠性与质量说明

该产品遵循多项行业标准:

  • 温度循环测试:-55℃~155℃循环1000次,阻值变化率≤0.5%;
  • 耐湿性能:40℃/95%RH环境下1000小时,阻值变化≤1%;
  • 过载能力:额定功率1.5倍过载1000小时,阻值变化≤0.2%;
  • 环保认证:无铅无卤,符合欧盟RoHS 2.0及REACH法规。

该产品凭借“小封装、宽温、精准、可靠”的综合优势,成为工业控制、消费电子、便携设备等领域的高性价比选择,适配多种自动化贴装生产线,满足量产化设计需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.