Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FOJAN FRC0402F5113TS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOJAN FRC0402F5113TS
- Type
- FOJAN
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- FOJAN
- Electronic Component
- FRC0402F5113TS
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.01g
- Electronic Component
- 511kΩ
- Electronic Component
- 10
- Electronic Component
- BM0264524754
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC0402F5113TS 产品概述
一、产品简介
FRC0402F5113TS 是 FOJAN（富捷）推出的一款厚膜贴片电阻，封装为 0402（典型尺寸 1.0 mm × 0.5 mm），阻值 511 kΩ，精度 ±1%，额定功率 62.5 mW，额定工作电压 50 V，温度系数（TCR）±100 ppm/℃，工作温度范围 -55 ℃ 至 +155 ℃。该系列以体积小、稳定性好、成本可控为特点，适用于高密度 SMT 板级应用。
二、主要规格
- 型号：FRC0402F5113TS
- 品牌：FOJAN（富捷）
- 阻值：511 kΩ
- 精度：±1%（1/100）
- 功率：62.5 mW（0402 封装典型额定值）
- 工作电压：50 V
- 温度系数：±100 ppm/℃
- 工作温度：-55 ℃ ~ +155 ℃
- 电阻类型：厚膜电阻（贴片）
三、特性与优势
- 小型化：0402 封装适合高密度布局，有利于减小 PCB 面积。
- 精度高：±1% 满足多数精密分压和阻值匹配需求。
- 宽温度范围：-55 ℃ 至 +155 ℃，可用于工业级环境。
- 良好稳定性：厚膜工艺在成本与性能之间取得平衡，适合大批量应用。
- 兼容 SMT 工艺：支持常规回流焊工艺，便于自动化生产。
四、典型应用场景
- 移动通信与消费电子：滤波、偏置、上拉/下拉电阻。
- 工业控制与测量：阻值网络、分压、传感器前端。
- 电源管理与模拟电路：反馈网络、参考分压。
- 物联网与模块化设备：体积受限的传感与接口电路。
五、PCB 设计与焊接建议
- 推荐按厂商或 IPC 标准的 0402 焊盘开窗设计以保证焊接可靠性。
- 建议遵循常规铅无铅回流焊曲线（参考 IPC/JEDEC），避免过长高温暴露影响稳态性能。
- 在高阻值、大电压应用中注意爬电与击穿间距，保持足够的焊盘间隔和洁净表面。
- 对于精密测量电路，布局时尽量缩短引线长度，避免噪声耦合。
六、可靠性与测试
- 建议关注常规的环境与机械测试项目：温度循环、湿热试验、热冲击、机械振动及阻值漂移测试。
- 对高阻值元件，出厂后应进行电阻值、绝缘电阻和耐压测试以保证合格率。
七、包装与采购信息
- 标准卷带包装（Tape & Reel），适配自动贴片机。
- 订购时请注明型号 FRC0402F5113TS、数量、包装、以及是否需特殊检测报告或追溯编码。
总结：FRC0402F5113TS（FOJAN 厚膜 0402，511 kΩ ±1%）在体积、精度和温度范围上具有良好平衡，适用于要求小型化与稳定性的各类电子产品。选择与设计时请参照厂商详细数据手册与 PCB 焊盘规范以获得最佳可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
