WMSIC Electronic Components

FOJAN FRC0402F1243TS

ModelFRC0402F1243TS
Package0402
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0402F1243TS
Type
FOJAN
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0402F1243TS
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.01g
Electronic Component
124kΩ
Electronic Component
10
Electronic Component
BM0264521725
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0402F1243TS 厚膜贴片电阻产品概述

一、产品基本信息

FRC0402F1243TS是富捷电子(FOJAN) 推出的一款小型化厚膜贴片电阻,采用行业标准0402封装(英寸制:0.04英寸×0.02英寸;公制:1.0mm×0.5mm),专为高密度PCB设计的小信号电路开发。型号中“FRC”为富捷电阻系列标识,“0402”明确封装尺寸,“1243”为阻值编码(124×10³Ω=124kΩ),“F”对应±1%精度等级,“TS”关联产品的温度特性与工艺版本。

二、核心性能参数详解

该电阻的关键参数匹配工业级与汽车电子的基础需求,具体如下:

  1. 阻值与精度:标称阻值124kΩ,精度±1%——满足模拟电路信号分压、匹配的基本精度要求,避免因阻值偏差导致的信号失真;
  2. 功率与电压:额定功率62.5mW,最大工作电压50V——需注意功率-电压降额:当实际工作电压接近50V时,功耗需控制在62.5mW以内(如电流≤125μA),高温155℃环境下建议功耗≤31mW(降额50%);
  3. 温度系数(TC):±100ppm/℃——厚膜电阻的常规温漂范围,对应温度变化100℃时,阻值变化≤12.4Ω,可满足多数常温至宽温场景的稳定性;
  4. 工作温度范围:-55℃+155℃——覆盖工业控制、汽车电子的典型环境温度(如户外PLC、汽车仪表盘),远超消费级产品(一般-40℃+85℃);
  5. 封装可靠性:陶瓷基板+厚膜电阻浆料工艺,兼容无铅回流焊(峰值245℃±5℃,过温时间≤10s)与波峰焊,焊接后抗机械应力性能稳定。

三、典型应用场景

结合参数特性,FRC0402F1243TS适用于以下场景:

  1. 工业控制模块:PLC输入输出接口、传感器信号调理电路——宽温范围适配户外 harsh环境,1%精度保证信号采集准确性;
  2. 汽车电子辅助系统:车身控制模块(BCM)、仪表盘背光调节、胎压监测传感器电路——满足车规级-40℃~+125℃(部分场景延伸至-55℃)的温度要求;
  3. 消费电子高密度设计:智能手机主板、智能穿戴设备(如智能手表心率模块)——0402封装节省PCB空间,适配小型化趋势;
  4. 通信设备射频前端:低功率信号匹配网络、滤波电路——小尺寸不影响射频性能,62.5mW功率满足小信号传输需求;
  5. 医疗电子低功耗模块:便携式血糖监测仪、助听器——宽温下的稳定性保证设备在不同环境(如低温户外、高温室内)的正常工作。

四、选型与替换注意事项

  1. 同参数替换:若需替换,需确认以下条件:封装0402、阻值124kΩ±1%、额定功率≥62.5mW、工作温度范围≥-55℃~+155℃(如国巨0402封装124kΩ±1%厚膜电阻);
  2. 精度升级:若需更高精度(如±0.1%),需切换至薄膜电阻(如低温漂镍铬薄膜),但成本约提升2~3倍;
  3. 功率扩容:若实际功耗超过62.5mW,需更换更大封装(如0603封装,额定功率100mW),同时需调整PCB焊盘尺寸;
  4. 温区扩展:若需175℃以上高温环境,需选择车规级高温厚膜电阻(TC≤±50ppm/℃),如富捷FRC系列的高温版本。

五、总结

FRC0402F1243TS是一款高性价比、小型化、宽温可靠的厚膜贴片电阻,精准匹配工业、汽车、消费电子等领域的高密度电路需求,在保证基本精度与功率的前提下,兼顾成本与可靠性,是小信号电路设计的常规选型之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.