WMSIC Electronic Components

FOJAN FRC0805J102 TS FRC0805J102

ModelFRC0805J102 TS
Package0805
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0805J102 TS
Type
FOJAN
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0805J102 TS
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.028g
Electronic Component
1kΩ
Electronic Component
1
Electronic Component
BM0264520379
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0805J102 TS 贴片厚膜电阻产品概述

一、产品基本属性

FRC0805J102 TS 是富捷电子(FOJAN)推出的0805封装厚膜贴片电阻,型号含义清晰:

  • FRC:富捷电阻系列标识;
  • 0805:英制封装尺寸(对应公制2012,长2.0mm×宽1.2mm);
  • J:精度等级为±5%;
  • 102:阻值代码(前两位“10”+第三位“2”×10²=1kΩ);
  • TS:关联温度特性优化设计。

产品采用厚膜工艺制造,符合RoHS 2.0及REACH环保标准,适配自动化SMT生产线贴装。

二、核心性能参数详解

(一)阻值与精度

标称阻值1kΩ(1000Ω),精度±5%(J级),25℃参考温度下实际阻值范围为950Ω~1050Ω,满足常规电路的阻值匹配需求。

(二)功率与电压容量

  • 额定功率:1/8W(125mW);
  • 额定工作电压:150V;
  • 注意:实际使用需同时满足功率限制(P=V²/R),若电压达150V,理论功率22.5W远超额定值,需将工作电压降至约11.2V以下以保证功率不超限。

(三)温度特性

温度系数(TCR)为**±100ppm/℃**,即温度每变化1℃,阻值变化±0.01%。在工作温度范围内(-55℃~+155℃),阻值最大变化量为:

  • 155℃时:(155-25)×100ppm=1.3%;
  • -55℃时:(25+55)×100ppm=0.8%;
    结合精度±5%,整体阻值漂移可控。

(四)工作温度范围

  • 工作温度:-55℃~+155℃;
  • 存储温度:-65℃~+155℃;
    覆盖工业级、汽车级极端环境要求。

三、典型应用场景

(一)汽车电子领域

适配汽车发动机舱(-40℃~+125℃)、车载系统:

  • 传感器信号调理(如胎压监测模块分压);
  • LED驱动限流(中控按键背光);
  • 电源反馈网络(车载充电器电压采样)。

(二)工业控制设备

应用于PLC、伺服驱动、工业传感器:

  • PLC I/O接口电路(信号滤波);
  • 伺服电机电流采样(小功率电路匹配);
  • 温度传感器信号放大(阻值稳定抗漂移)。

(三)消费电子与通信

  • 智能手机/平板:射频电路匹配、DC-DC反馈电阻;
  • 蓝牙耳机:音频信号调理(低噪声特性);
  • 通信基站:小型化射频模块滤波网络。

(四)电源与照明

  • LED驱动电源:限流电阻(适配小功率LED串);
  • 小型开关电源:电压采样(高密度布局需求)。

四、设计与可靠性优势

(一)小体积高密度

0805封装(2.0mm×1.2mm)适合PCB高密度布局,可缩小产品体积,满足便携式设备小型化需求。

(二)宽温稳定可靠

厚膜工艺赋予其良好的温度稳定性,±100ppm/℃的TCR及-55℃~+155℃工作范围,可在极端环境下保持阻值稳定,降低电路性能漂移风险。

(三)自动化生产兼容

符合SMT生产线标准,可实现高速贴装,降低制造成本,提升生产效率。

(四)环保合规

无铅无镉,满足全球环保市场准入要求,适配出口产品设计。

五、选型与使用注意事项

(一)功率/电压匹配

实际工作需计算功率消耗(P=I²R=V²/R),确保不超过125mW;同时工作电压不得超过150V,避免过压损坏。

(二)温度系数考量

若电路对阻值精度要求较高(如精密放大),需根据工作温度范围计算阻值变化量,必要时选择更高精度电阻。

(三)焊接与存储

  • 焊接:回流焊温度≤260℃,手工焊温度≤350℃(时间≤3秒);
  • 存储:湿度≤60%,避免长期暴露于潮湿环境。

FRC0805J102 TS 凭借稳定的性能、宽温适应性及小体积优势,成为工业、汽车、消费电子等领域常规电路的高性价比选型。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.