WMSIC Electronic Components

FOJAN FRC0402F6651TS

ModelFRC0402F6651TS
Package0402
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0402F6651TS
Type
FOJAN
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0402F6651TS
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.01g
Electronic Component
6.65kΩ
Electronic Component
10
Electronic Component
BM0265086279
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0402F6651TS 产品概述

一、产品简介

FRC0402F6651TS 是 FOJAN(富捷)推出的一款0402封装厚膜贴片电阻,标称阻值 6.65 kΩ,精度 ±1%,额定功率 62.5 mW,工作电压 50 V。该型号针对空间受限、对精度与长期稳定性有一定要求的表面贴装电路设计,兼顾小体积与可靠性,适用于消费电子、通信终端与传感类产品的电阻网络与分压、偏置场合。

二、主要参数

  • 阻值:6.65 kΩ
  • 精度:±1%(1/100)
  • 功率:62.5 mW(0402 封装典型功率等级)
  • 最大工作电压:50 V
  • 温度系数(TCR):±100 ppm/℃
  • 工作温度范围:-55 ℃ ~ +155 ℃
  • 结构类型:厚膜电阻(薄膜对比成本优势明显)
  • 封装:0402(英寸制,1.0 mm × 0.5 mm 级别)
  • 品牌:FOJAN(富捷)

三、产品特性

  • 小型化设计:0402 封装适合高密度贴装,节省 PCB 面积。
  • 稳定性与一致性:±1% 精度配合 ±100 ppm/℃ 的温漂,满足中高精度电路的阻值稳定性需求。
  • 宽温适应:-55 ℃ 至 +155 ℃ 的工作温度范围,适应工业级与民用环境温度变化。
  • 良好机械与焊接适配性:适用于自动贴片机与回流焊工艺,便于量产组装。
  • 成本与可靠性平衡:厚膜工艺在成本控制下提供可靠的电阻特性,适合大批量应用。

四、典型应用场景

  • 移动设备与便携式终端的分压、偏置网络;
  • 传感器前端及信号调理电路;
  • 通信设备与射频模块的偏置、终端电阻(需评估高频性能);
  • 工业控制、仪表与电源管理中的阻值匹配与限流;
  • 消费类电子、物联网节点的常规电阻应用。

五、封装与装配建议

  • 包装形式:标准卷带包装,适配 SMT 自动贴装流程(请按采购确认具体卷盘规格)。
  • 焊接工艺:建议使用无铅回流焊,遵循元件最大回流温度和时间的工艺规范(典型 260 ℃ 峰值短时加热)。
  • 安装注意:避免在贴装与回流过程中对器件施加过大的机械应力,回流后如需清洗,选用与电阻材料兼容的清洗剂并控制浸泡与温度。
  • 储存:避免高湿与强光照射,长期储存建议按潮湿敏感器件(MSL)管理。

六、可靠性与测试

FRC0402F6651TS 采用厚膜工艺制造,通常需通过常规电气与环境应力试验验证,如高温保存、温度循环、湿热试验与负载寿命测试。针对关键应用建议在设计阶段进行加速寿命与机电可靠性评估,以确保在目标使用环境下满足寿命与漂移要求。

七、选型与采购提示

在选型时,除阻值与精度外,应关注功率裕量(实际功耗不应接近额定功率)、工作电压余量、温漂对系统精度的影响以及焊接与封装需求。采购时请以 FOJAN 官方或授权代理提供的完整规格书为准,并确认包装、批次与检验报告以保证一致性。

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