WMSIC Electronic Components

FOJAN FRC0402F1372TS

ModelFRC0402F1372TS
Package0402
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0402F1372TS
Type
FOJAN
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0402F1372TS
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.01g
Electronic Component
13.7kΩ
Electronic Component
10
Electronic Component
BM0265085730
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0402F1372TS — 13.7kΩ ±1% 62.5mW 厚膜贴片电阻(0402)

一、产品概述

FRC0402F1372TS 是 FOJAN(富捷)出品的0402封装厚膜贴片电阻,标称阻值13.7kΩ,精度±1%,额定功率62.5mW,额定工作电压50V。器件采用厚膜工艺,尺寸微小,适合高密度表面贴装(SMT)电路板,工作温度范围-55℃至+155℃,温度系数为±100ppm/℃,兼顾体积与电性能的平衡。

二、主要技术参数

  • 阻值:13.7kΩ
  • 精度:±1%(±0.01)
  • 额定功率:62.5mW(典型室温功率)
  • 最大工作电压:50V
  • 温度系数(TCR):±100ppm/℃
  • 工作温度范围:-55℃ ~ +155℃
  • 封装:0402(尺寸适用于超小型贴片设计)
  • 工艺类型:厚膜电阻

三、性能与可靠性

厚膜材料提供良好的长期稳定性和重复性,适用于一般电子产品与工业控制场合。器件在标称条件下具有可靠的电阻稳定性与抗振动、抗冲击能力。高温下应按制造商功率降额曲线进行使用,以避免过载带来的热应力和阻值漂移。

四、封装与焊接建议

0402体积极小,建议使用自动贴装(贴片机)与回流焊工艺,遵循无铅回流工艺和相应的温度曲线规范。由于体积小,安装时应注意焊盘设计与焊膏印刷量,避免立碑或虚焊。器件表面无明显标识,建议通过物料管理系统控制出货与贴装。

五、典型应用场景

  • 手机、穿戴设备等消费类便携电子产品中的分压、限流与阻抗匹配
  • IoT 节点、传感器模组和低功耗电路的信号与基准电阻
  • 工业控制与通信设备中对体积与精度有要求的阻值元件

六、订购信息与包装

型号:FRC0402F1372TS;品牌:FOJAN(富捷)。常见为卷带(Tape & Reel)包装,适配自动贴装生产线。订购时请确认阻值与精度需求、最小起订量及交期,并索取完整规格书与回流焊兼容性说明以保证设计与生产的一致性。

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