WMSIC Electronic Components

FOJAN FRC0402F6042TS

ModelFRC0402F6042TS
Package0402
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0402F6042TS
Type
FOJAN
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0402F6042TS
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.01g
Electronic Component
60.4kΩ
Electronic Component
10
Electronic Component
BM0264521514
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0402F6042TS 厚膜贴片电阻产品概述

一、产品定位

FRC0402F6042TS是富捷电子(FOJAN)推出的0402封装厚膜贴片电阻,针对小体积、低功耗、高精度的电子设计需求,兼顾可靠性与成本效益,广泛适配便携消费电子、小型工业控制及通信模块等场景。

二、核心参数明细

该电阻的关键参数均经过标准化设计,满足常规电子电路的性能要求:

  • 阻值规格:60.4kΩ(数字标识为“6042”,即60.4×10²Ω),阻值精度控制在±1%以内;
  • 功率等级:额定功率62.5mW(0.0625W),适配低功耗电路的功率需求;
  • 工作电压:最大工作电压50V,明确安全使用上限;
  • 温度特性:温度系数±100ppm/℃,阻值随温度变化的漂移量较小;
  • 工作温度范围:-55℃至+155℃,覆盖工业级与消费级设备的环境温度需求;
  • 封装尺寸:0402(英制尺寸,约1.0mm×0.5mm),属于小型化贴片封装。

三、性能优势

  1. 小体积高密度:0402封装体积仅为常规0805封装的1/4左右,可显著提升电路板集成度,适配智能手环、蓝牙耳机等小型化设备;
  2. 厚膜工艺可靠性:采用成熟的厚膜电阻制造工艺,抗机械冲击、抗老化性能优异,长期使用阻值稳定性好;
  3. 宽温适应能力:-55℃~+155℃的工作温度范围,可满足户外设备、车载辅助电路(部分场景)等极端温度环境;
  4. 低功耗适配性:62.5mW额定功率与50V工作电压的组合,可覆盖传感器信号调理、微控制器周边电路等低功耗设计;
  5. 品牌品控保障:FOJAN作为专业电子元器件厂商,该产品经过高低温循环、湿度老化、焊接兼容性等多项测试,一致性符合行业标准。

四、典型应用场景

该电阻的参数特性使其在多个领域具备应用价值:

  • 便携消费电子:智能手表、蓝牙耳机、移动电源的信号分压、滤波电路(如充电管理模块的电压采样);
  • 小型工业控制:微型传感器模块(如温湿度传感器)的偏置电阻、低功耗PLC的输入输出电路;
  • 通信设备:小型基站、无线蓝牙模块的射频匹配电路(低功率段);
  • 汽车电子(辅助场景):车载USB充电模块、车内氛围灯控制电路(需结合具体汽车级认证,但宽温特性适配部分场景)。

五、封装与焊接说明

  • 封装类型:0402贴片封装,符合IPC J-STD-001标准,兼容常规SMT贴装设备;
  • 焊接兼容性:支持回流焊(建议温度范围220℃~245℃)、波峰焊(需控制焊接时间≤3秒),焊接后无开路、短路等问题;
  • 标识方式:采用数字编码标识阻值,便于生产过程中的识别与检测。

六、总结

FRC0402F6042TS作为一款平衡体积、精度与可靠性的厚膜贴片电阻,可满足中小批量及量产电子设计的需求,是便携设备、小型工业控制等领域的优选元器件之一。

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