WMSIC Electronic Components

FOJAN FRC0805F2212TS

ModelFRC0805F2212TS
Package0805
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0805F2212TS
Type
FOJAN
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0805F2212TS
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.028g
Electronic Component
22.1kΩ
Electronic Component
1
Electronic Component
BM0264525361
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0805F2212TS 厚膜贴片电阻产品概述

一、产品核心定位与典型应用场景

FRC0805F2212TS是富捷(FOJAN)推出的0805封装厚膜贴片电阻,主打「中精度、宽温适应性、小功率信号电路」应用,覆盖四大主流电子领域:

  • 消费电子:手机/平板音频信号分压、电源模块反馈限流、耳机接口阻抗匹配;
  • 工业控制:传感器信号调理基准分压、PLC输入端口限流保护、小型电机驱动限流;
  • 汽车电子:车载仪表盘背光电路分压、传感器接口信号匹配、车载USB充电限流;
  • 通信设备:射频前端阻抗匹配、基站电源滤波分压、路由器信号衰减网络。

二、关键参数解析与性能优势

该电阻的核心参数直接匹配应用场景需求,关键指标及实际意义如下:

  1. 阻值与精度:标称阻值22.1kΩ(代码2212,即221×10²Ω),精度±1%——满足信号处理电路对阻值一致性要求,无需额外校准即可实现稳定分压/限流;
  2. 功率与电压:额定功率125mW(0805封装常规功率等级),最大工作电压150V——需注意功率降额优先(实际连续负载建议≤100mW),避免过热导致阻值漂移;
  3. 温度系数(TCR):±100ppm/℃——温度每变化1℃,阻值变化±0.01%;在工作温区(-55℃~155℃)内,最大阻值变化约±1%,与精度指标完全匹配,宽温下性能稳定;
  4. 工作温度范围:-55℃~+155℃——达到工业级宽温标准,可适应汽车发动机舱(高温)、北方户外设备(低温)等极端环境。

三、封装与工艺特性

  1. 封装规格:0805英制封装(公制2012,尺寸2.0mm×1.2mm)——体积小巧,适合高密度PCB设计,兼容主流贴装设备(如ASM、YAMAHA);
  2. 厚膜工艺:采用「氧化铝陶瓷基底+丝网印刷电阻浆料+银钯电极层」结构——成本低于薄膜电阻,同时具备较好的抗冲击性与长期稳定性,适合批量生产;
  3. 品牌背书:富捷(FOJAN)作为国内被动元件成熟厂商,产品通过ISO9001、IATF16949认证,符合ROHS、REACH等环保标准,可提供SGS检测报告。

四、可靠性与环境适应性验证

该电阻经过多项可靠性测试,确保长期使用稳定性:

  • 温湿度循环测试:-55℃(30min)→25℃(5min)→155℃(30min)循环100次,阻值变化率≤±0.5%;
  • 功率负载测试:125mW额定功率下连续工作1000小时,阻值变化率≤±0.2%;
  • 焊接可靠性:兼容回流焊(峰值温度245℃±5℃,峰值时间≤30s)、波峰焊工艺,焊接后无开路、短路及阻值漂移问题;
  • 机械性能:承受5000次振动(频率10~2000Hz,加速度2g)后,性能无明显变化。

五、选型与应用注意事项

  1. 功率降额原则:实际工作功耗建议不超过额定功率的80%(即≤100mW),避免长期过热导致阻值老化;
  2. 电压与功率关联:实际工作电压需同时满足「≤150V」与「V≤√(P×R)」(如100mW时,最大电压≈47V),优先以功率降额为准;
  3. 温度系数匹配:若电路对温度敏感(如高精度压力传感器),需确认±100ppm/℃是否满足需求,必要时选择更低TCR(如±50ppm/℃)的电阻;
  4. 焊接工艺规范:遵循富捷推荐的回流焊曲线(升温速率≤3℃/s,冷却速率≤4℃/s),避免过温损坏电阻浆料。

该电阻凭借稳定的性能、宽温适应性及高性价比,成为中小功率信号电路的主流选型之一,可直接替代同类进口品牌(如国巨、三星)的同规格产品。

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