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FOJAN FRC0603F8201TS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOJAN FRC0603F8201TS
- Type
- FOJAN
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- FOJAN
- Electronic Component
- FRC0603F8201TS
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.023g
- Electronic Component
- 8.2kΩ
- Electronic Component
- 1
- Electronic Component
- BM0261485666
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC0603F8201TS 产品概述
一、产品简介
FRC0603F8201TS 为 FOJAN（富捷）出品的贴片厚膜电阻，阻值 8.2kΩ，公差 ±1%，额定功率 100mW，适用于对尺寸、精度及可靠性有较高要求的高密度表面贴装电路。0603 封装尺寸小巧，便于自动化贴装，适配现代消费类与工业电子产品的设计需求。
二、主要性能参数
- 电阻类型：厚膜电阻（Thick Film）
- 阻值：8.2 kΩ
- 精度：±1%（1/100）
- 额定功率：100 mW（常温额定）
- 最高工作电压：75 V
- 温度系数（TCR）：±100 ppm/℃
- 工作温度范围：-55 ℃ ~ +155 ℃
- 封装：0603（约 1.6 mm × 0.8 mm）
- 品牌：FOJAN（富捷）
三、结构与封装
FRC0603F8201TS 采用常见的厚膜电阻工艺，电阻体与端电极通过薄膜印刷与烧结形成，外覆保护层以提高耐环境性能。0603 封装兼具体积小与良好热特性，适合高密度电路板布线与表面贴装工艺，支持回流焊装配。
四、典型应用场景
- 移动设备与消费电子（滤波、分压、偏置网络）
- 通信设备与射频前端（阻抗匹配与偏置）
- 工业控制与测量仪器（精密分压、参考）
- 汽车电子（在符合温度与可靠性要求的前提下作一般信号电路使用）
- 各类主板、模块的去耦与上拉/下拉电阻
五、可靠性与使用注意事项
- 温度系数 ±100 ppm/℃ 适合一般温度稳定性要求的电路，如需更高稳定性应选用更低 TCR 的型号。
- 在高温或高电压环境中应考虑降额使用以保证长期可靠性；额定功率在环境温度升高时需按厂方降额曲线调整。
- 建议遵循标准回流焊曲线进行焊接，避免超出推荐的峰值温度与时间以防电阻值漂移或封装损伤。
- 长时间暴露于潮湿或腐蚀性气氛可能影响端电极与保护层，存储与使用环境应尽量干燥、通风。
六、采购与技术支持
FOJAN（富捷）提供量产级品质与批量供货支持，FRC0603F8201TS 适合批量贴装与自动化生产。如需样品、可靠性测试数据（如湿热、温度循环、机械冲击等）或器件管脚图与回流曲线，请联系供应商技术支持获取详细资料与应用建议。
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