WMSIC Electronic Components

FOJAN FRC2010J100 TS FRC2010J100

ModelFRC2010J100 TS
Package2010
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC2010J100 TS
Type
FOJAN
Minimum package
4000 圆盘

Technical parameters

Power
750mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC2010J100 TS
Electronic Component
1
Package
2010
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.044g
Electronic Component
10Ω
Electronic Component
1
Electronic Component
BM0264520789
Operating Temperature
55℃~+155℃
Operating Voltage
200V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC2010J100 TS 厚膜电阻产品概述

一、产品基本定位与品牌背景

FRC2010J100 TS是富捷电子(FOJAN) 推出的工业级厚膜贴片电阻,隶属于其FRC系列厚膜电阻产品线。富捷电子作为国内专注被动元器件研发生产的厂商,该系列产品针对中功率、高可靠性场景优化,兼顾成本与性能,广泛适配工业控制、电源、通信等领域的标准化设计需求,是替代进口同规格产品的高性价比选择。

二、核心性能参数详解

本产品核心参数围绕“中功率、宽温区、耐高压”设计,关键指标及实际意义如下:

  • 阻值与精度:标称阻值10Ω,精度等级±5%(标识“J”),满足多数非精密电路的分压、限流、电流采样需求,无需额外校准即可适配常规工业电路;
  • 功率与耐压:额定功率750mW(0.75W),比同封装(2010)普通薄膜电阻功率提升约50%;最大工作电压200V,适配小电流高压场景(如高压滤波支路、DC-DC转换器的高压端采样);
  • 温度特性:温度系数(TC)±200ppm/℃,即每变化1℃,阻值漂移≤0.02%,100℃温变下阻值变化仅0.2Ω,满足宽温环境下的信号稳定性要求;
  • 工作温区:-55℃~+155℃,覆盖工业级全温区,可稳定工作于户外设备、车载辅助系统等极端环境。

三、封装与物理特性

本产品采用2010公制贴片封装(对应英制0805),物理尺寸为2.0mm×1.0mm×0.5mm(长×宽×高),符合IPC标准封装规范:

  • 表面贴装设计,兼容自动化贴装生产线(贴片机精度≥01005级别即可适配),提升生产效率;
  • 焊盘采用“端电极+侧面延伸”结构,焊接时可形成“三明治”焊点,降低虚焊风险,提升长期可靠性;
  • 无铅环保(Sn-Cu合金镀层),符合RoHS 2.0、REACH等国际环保标准,适配出口产品及绿色制造需求。

四、典型应用场景

结合参数特性,FRC2010J100 TS的核心应用场景包括:

  1. 工业控制电路:PLC(可编程逻辑控制器)输入输出接口限流、变频器电流采样支路、工业传感器信号调理;
  2. 电源模块:DC-DC转换器电压反馈分压、LED驱动电源电流调节、开关电源滤波支路;
  3. 通信设备:小型基站射频偏置电路、光纤收发器信号滤波、路由器电源模块限流;
  4. 汽车电子:车载温度/压力传感器信号滤波、倒车雷达辅助系统电源限流、车载充电器过流保护;
  5. 消费电子:智能家居温控器信号调理、智能插座过流保护、便携设备充电模块分压。

五、设计优势与可靠性

  1. 厚膜工艺优势:采用“丝网印刷+高温烧结”厚膜工艺,相比薄膜电阻具有更强的浪涌耐受能力(可承受10倍额定功率的短时间浪涌),且功率密度更高;
  2. 长期稳定性:经1000小时+125℃老化测试后,阻值漂移≤0.5%,满足工业设备5年以上的使用寿命要求;
  3. 焊接可靠性:端电极采用三层结构(镍层+铜层+锡层),兼容回流焊(260℃峰值温度)、波峰焊工艺,焊点剪切强度≥10N,符合IEC 60068-2-21标准;
  4. 抗环境干扰:环氧树脂包封封装,具备防潮(95%RH/40℃环境下长期工作)、防盐雾(符合GB/T 2423.17标准)能力,适配恶劣工业环境。

六、选型匹配建议

本产品适用于以下设计场景:

  • 需10Ω±5%阻值、额定功率≤750mW、最大电压≤200V;
  • 工作环境温度在-55℃~+155℃之间;
  • 采用2010贴片封装的标准化电路设计。

若需调整参数,可参考同系列衍生型号:

  • 精度需求±1%:可选FRC2010F100 TS;
  • 功率需求1W:可选FRC2512J100 TS;
  • 电压需求300V:可选FRC2010J100 HV型号。

FRC2010J100 TS凭借宽温区、高功率密度及高可靠性,成为工业控制、电源等领域的主流选型之一,可有效降低电路设计成本并提升系统稳定性。

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