WMSIC Electronic Components

FOJAN FRC0603F1692TS

ModelFRC0603F1692TS
Package0603
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0603F1692TS
Type
FOJAN
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0603F1692TS
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
16.9kΩ
Electronic Component
1
Electronic Component
BM0264520464
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0603F1692TS 厚膜贴片电阻产品概述

FRC0603F1692TS是FOJAN(富捷)品牌推出的0603封装厚膜贴片电阻,专为小型化、高可靠性电子电路设计,核心参数覆盖工业级应用需求,适用于消费电子、工业控制及通信设备等场景。

一、产品基本属性

该电阻基础参数清晰明确,可直接匹配电路设计需求:

  • 封装规格:0603(英制代码,公制尺寸1.6mm×0.8mm),符合表面贴装技术(SMT)标准;
  • 电阻类型:厚膜贴片电阻,采用丝网印刷+烧结工艺制作;
  • 阻值与精度:标称阻值16.9kΩ(代码标识“1692”,即169×10²Ω),精度±1%;
  • 功率与电压:额定功率100mW(0.1W),最大连续工作电压75V;
  • 温度特性:温度系数±100ppm/℃,工作温度范围-55℃~+155℃;
  • 品牌:FOJAN(富捷),国内专业元器件制造商,产品稳定性经市场验证。

二、核心性能参数详解

1. 阻值精度与稳定性

标称阻值16.9kΩ,±1%精度可满足多数电路的基础匹配需求(如分压、限流、信号调理)。需注意:精度为25℃参考温度下的偏差,实际使用需结合温度系数考虑整体漂移。

2. 功率与电压限制

  • 额定功率100mW:25℃环境下长期稳定工作的最大耗散功率;环境温度超25℃时需降额(如155℃时降额至约20mW);
  • 最大电压75V:需结合功率匹配(实际最大连续电压( U \leq \sqrt{0.1W \times 16.9kΩ} \approx 41V )),避免电压过高导致功率超标。

3. 温度特性

温度系数±100ppm/℃表示:温度每变1℃,阻值变±0.01%。典型场景示例:

  • 25℃→155℃(变130℃):阻值最大漂移≈220Ω,范围16.68kΩ~17.12kΩ;
  • 宽温漂移可覆盖工业环境波动,无需额外补偿即可满足一般应用。

4. 工作温度范围

-55℃~+155℃适应户外低温、工业高温(如烤箱、电机周边)等极端环境,避免温度超限失效。

三、封装与工艺优势

1. 0603封装适配性

尺寸小巧(1.6mm×0.8mm),节省PCB空间,适合智能手环、微型传感器等小型设备;兼容自动化SMT生产线,焊接效率高、成本低。

2. 厚膜工艺性价比

采用钌系浆料丝网印刷+烧结,相比薄膜电阻成本更低,且耐过载能力强(短时间可承受2倍额定功率),适合批量应用。

四、典型应用场景

结合参数特点,主要适用于:

  1. 消费电子:智能手表充电保护(限流/分压)、小型家电控制电路;
  2. 工业控制:传感器信号调理(如温度传感器分压输出)、小型PLC辅助逻辑;
  3. 通信设备:小型路由器电源分压、无线模块信号衰减;
  4. 汽车电子:车载USB充电器限流(需确认环境温度符合宽温要求)。

五、应用注意事项

  1. 功率降额:环境温度超25℃时,按FOJAN降额曲线调整功率(如100℃时降额至50mW);
  2. 焊接工艺:SMT温度≤260℃(峰值≤280℃),焊接时间≤3秒,避免过热;
  3. 静电防护:虽抗静电能力强,生产环节仍需避免直接接触;
  4. 精密场景补偿:若需高稳定性(如精密测量),需加入温度补偿电路。

综上,FRC0603F1692TS以高性价比、宽温范围及小巧封装为核心优势,是批量电子电路的优选元件之一。

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