Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FOJAN FRC0402F4122TS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOJAN FRC0402F4122TS
- Type
- FOJAN
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- FOJAN
- Electronic Component
- FRC0402F4122TS
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.01g
- Electronic Component
- 41.2kΩ
- Electronic Component
- 10
- Electronic Component
- BM0264602994
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC0402F4122TS 产品概述
一、产品简介
FRC0402F4122TS 为 FOJAN(富捷) 系列厚膜贴片电阻，封装尺寸为 0402（公制 1005）。标称阻值 41.2kΩ，精度 ±1%，额定功率 62.5mW，最大工作电压 50V，温度系数 (TCR) ±100ppm/℃，工作温度范围 -55℃ 至 +155℃。该器件以体积小、温漂稳定、适配高密度贴片组装为特点，适用于各种消费电子、通信和工业控制设备中的阻值精密分压、滤波与偏置电路。
二、主要技术参数
- 阻值：41.2kΩ
- 精度：±1%（B级）
- 功率额定：0.0625W（62.5mW）
- 最大工作电压：50V
- 温度系数：±100ppm/℃
- 工作温度：-55℃ ~ +155℃
- 结构类型：厚膜电阻（0402 封装）
- 封装尺寸：0402（1005 公制）
三、产品特点
- 体积极小，适合高密度 PCB 布局和微型化产品设计；
- 较窄 TCR，温度稳定性良好，适用于对温漂有一定要求的电路；
- ±1% 精度适配多数模拟与数字电路的分压与偏置需求；
- 额定功率与工作电压满足常见低功耗信号路径应用；
- 厚膜工艺具备成本优势，良好的一致性和可批量生产性能；
- 兼容常规无铅回流焊工艺，便于 SMT 生产线集成。
四、典型应用场景
- 移动终端与便携设备的信号偏置和分压网络；
- 串联/并联定阻电路、阻容滤波与采样电路；
- 工业控制与通信设备中对体积和精度有平衡要求的场合；
- 汽车电子（非关键安全路径）与消费电子的阻值匹配应用。
五、可靠性与环境适应
FRC0402F4122TS 设计用于满足电子行业常规可靠性要求，适应 -55℃ 至 +155℃ 的宽温区间。建议在实际系统设计中考虑环境温度对额定功率的降额影响：环境温度升高时应进行功率降额或采取散热与布局优化，以保证长期稳定可靠运行。
六、使用与安装注意事项
- 建议参考厂商 PCB 焊盘尺寸与锡膏印刷规范，保证良好焊接强度与热循环行为；
- 遵循常规 SMT 回流温度曲线（兼容无铅回流），避免超出器件承受的峰值温度和时间；
- 在高精度应用中，考虑阻值配对与温漂带来的偏差，必要时做温度补偿或选用更低 TCR 的电阻；
- 小尺寸封装对手工焊接不友好，推荐全自动贴装与回流流程。
七、包装与订购建议
0402 封装适合大规模片式卷装（reel）供应，便于 SMT 贴装。订购时请注明型号 FRC0402F4122TS、阻值与包装卷数，以便获取准确交期与价格。若有特殊可靠性或汽车级需求，请与供应商确认额外的认证与测试报告。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
