Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC0204J913 TS是一款厚膜贴片电阻,核心参数如下表所示,关键规格适配通用电子电路需求:
参数项 规格数值 补充说明 电阻类型 厚膜贴片电阻 陶瓷基底+厚膜电阻浆料工艺 标称阻值 91kΩ(代码913) 91×10³Ω,电子电路标准阻值 阻值精度 ±5% 通用精度等级,满足常规设计 额定功率 62.5mW 低功耗场景适配,无需过度降额 最大工作电压 50V(DC/AC) 覆盖直流36V及低频交流电路 温度系数(TCR) ±100ppm/℃ 温度变化1℃,阻值漂移≤9.1Ω 封装尺寸 0402(英制) 公制1.0mm×0.5mm,小型化设计 工作温度范围 -55℃ ~ +155℃ 极端环境耐受能力 品牌 FOJAN(富捷) 国内被动元器件专业厂商0402封装体积仅为1.0mm×0.5mm,可大幅节省PCB空间,尤其适合便携设备(手机、智能穿戴)、**高密度模块(路由器、PLC)**的紧凑布局;同时支持SMT自动贴装,提升生产效率,降低人工成本。
62.5mW额定功率覆盖90%以上低功耗电路需求,例如:
-55℃~+155℃的工作温度范围,可适配工业户外设备(低温环境)、**车载辅助系统(高温环境)**等极端场景;±100ppm/℃的温度系数确保温度变化时阻值漂移极小,不影响电路信号精度。
±5%精度适合不需要高精度的常规电路(如消费电子、小型家电);50V最大工作电压兼容直流电池(3.7V~48V)及低频交流电路,应用场景无明显限制。
厚膜电阻采用陶瓷基底,贴片封装无引线,抗冲击(1000g/0.1ms)、抗振动(10~2000Hz/1g)性能优于插件电阻,适合运输过程中易受振动的设备(如车载、工业机器人)。
符合RoHS 2.0标准,无铅无镉,满足全球电子市场环保要求;同时通过JEDEC封装标准,与主流贴片机兼容性强。
厚膜工艺成熟,阻值漂移率≤0.5%/1000小时(额定条件下),MTBF(平均无故障时间)可达10万小时以上,适合长期运行的设备。
FOJAN(富捷)是国内专注被动元器件研发生产的厂商,拥有12年厚膜电阻生产经验,产品通过ISO 9001质量管理体系认证;每批产品均经过:
针对批量订单提供不良品退换服务,售后响应时间≤24小时,确保客户生产顺利。
FRC0204J913 TS厚膜贴片电阻凭借小封装、宽温稳定、低功耗适配等特性,成为通用电子电路中替代传统插件电阻的理想选择,广泛覆盖多领域常规设计需求。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products