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FOJAN FRC0603F1183TS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOJAN FRC0603F1183TS
- Type
- FOJAN
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- FOJAN
- Electronic Component
- FRC0603F1183TS
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.023g
- Electronic Component
- 118kΩ
- Electronic Component
- 1
- Electronic Component
- BM0265086328
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC0603F1183TS 产品概述
一、产品简介
FRC0603F1183TS 是 FOJAN（富捷）推出的一款 0603 封装贴片厚膜电阻，阻值 118kΩ，精度 ±1%，额定功率 100mW，最高工作电压 75V。该器件工作温度范围广（-55℃ 至 +155℃），温度系数为 ±100 ppm/℃，适用于体积受限且对精度有一定要求的消费类与工业电子设备。
二、主要性能参数
- 电阻类型：厚膜电阻
- 阻值：118kΩ
- 精度：±1%
- 额定功率：100 mW（常温下）
- 最大工作电压：75 V
- 温度系数（TCR）：±100 ppm/℃
- 工作温度范围：-55℃ ~ +155℃
- 封装：0603（贴片）
三、产品特点
- 小型化：0603 封装适合高密度贴片电路板，节约 PCB 面积。
- 精度较高：±1% 精度可满足多数滤波、分压和参考网络的需求。
- 宽温区稳定性：-55℃ 至 +155℃ 的工作温度适应工业级环境。
- 标准化生产：厚膜工艺成本可控，良品率高，适合批量应用。
四、典型应用场景
- 电阻分压网络与偏置电路
- 滤波与时间常数电路（RC）
- 信号处理前端、放大器偏置元件（对噪声要求不极端严格的场合）
- 工业控制、通讯终端、消费电子与仪表类产品
五、选型建议与注意事项
- 功率裕量：额定功率 100 mW 是在规定温度下的数值，实际设计中应考虑温升与环境温度，必要时给予功率去评级（derating）以保证长期可靠性。
- 电压限制：若电路中存在高脉冲电压或瞬态，应确保峰值不超过 75 V 或采取保护措施。
- 温漂与精度：±100 ppm/℃ 的 TCR 对温度敏感度尚可；对于温漂或长期稳定性要求更高的精密应用，可优先考虑金属膜或薄膜电阻。
- 噪声特性：厚膜电阻相比薄膜/金属膜电阻噪声略高，重要信号通道应评估噪声影响。
六、封装与焊接建议
- 0603 小封装对焊接工艺要求较高，推荐采用标准回流焊工艺并遵循元件厂商的回流曲线。
- 避免在元件上施加机械应力（如 PCB 弯曲、元件挤压），以防焊接后发生电阻漂移或断裂。
- 清洗与助焊剂选择应兼容厚膜电阻，清洗后确保无腐蚀或残渣。
七、可靠性与测试建议
- 在产品验证阶段建议进行高低温循环、湿热测试和振动/跌落测试，以评估在目标应用环境下的稳定性。
- 对于批量采购，建议索取并核对厂方的检验报告（阻值分布、耐焊性、寿命测试等）。
八、结论
FRC0603F1183TS 提供了在微型化电路中较高精度与工业级温度范围的实用选择，适合一般电子偏置、分压与滤波场合。在选型与布局时应注意功率去评级、电压峰值及焊接工艺，以确保长期可靠性。若有更高精度、低噪或更大功率的需求，可与供应商或应用工程师进一步沟通替代方案与测试数据。
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