WMSIC Electronic Components

FOJAN FRC0805F5101TS

ModelFRC0805F5101TS
Package0805
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0805F5101TS
Type
FOJAN
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0805F5101TS
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.028g
Electronic Component
5.1kΩ
Electronic Component
1
Electronic Component
BM0261486292
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0805F5101TS 产品概述

一、产品简介

FRC0805F5101TS 是 FOJAN(富捷)推出的一款厚膜贴片电阻,阻值为 5.1kΩ,精度 ±1%,功率额定 125mW,封装为常见的 0805(2.0 × 1.25 mm)。该型号面向要求中高精度与可靠性的表面贴装电子产品,适合批量化 SMT 生产和自动化组装场景,型号后缀 TS 通常表示卷带包装,便于贴片机取放。

二、主要技术参数

  • 电阻类型:厚膜电阻
  • 阻值:5.1 kΩ
  • 精度:±1%
  • 额定功率:125 mW
  • 最大工作电压:150 V
  • 温度系数(TCR):±100 ppm/℃
  • 工作温度范围:-55 ℃ 至 +155 ℃
  • 封装尺寸:0805(2.0 × 1.25 mm)
  • 品牌:FOJAN(富捷)
  • 型号:FRC0805F5101TS

三、性能特点

  • 精度高:±1% 公差满足常见精密电阻网络与基准分压需求。
  • 温漂稳定:±100 ppm/℃ 的温度系数在多数中等精度应用中能保证阻值随温度变化较小。
  • 耐压性能好:150 V 的工作电压使其可用于较高电压的分压和偏置电路。
  • 可靠性:厚膜工艺加上标准化封装,适合自动化贴装和回流焊工艺,长期工作稳定性良好。
  • 通用性强:0805 大小在空间与可靠性之间取得平衡,适用于手机外设、消费电子和工业终端。

四、典型应用场景

  • 模拟电路中的分压器、偏置网络与反馈回路。
  • 数字电路的上拉/下拉电阻与接口匹配。
  • 测量与仪器仪表中的阻值网络。
  • 电源管理和滤波电路中作为电流限流或分压元件。
  • 工业控制、通信终端及消费者电子产品的标准贴片电阻需求。

五、封装与焊接注意事项

  • 0805 封装适配常见 SMT 贴片机取放,卷盘包装(TS)利于生产线连续贴装。
  • 建议按厂商推荐的回流焊温度曲线进行焊接,避免超出热应力导致阻值漂移或机械开裂。
  • 回流焊后建议进行外观与阻值检查,焊点良好时可保证长时间稳定工作。
  • 存储时避免高湿高温环境,防止表面氧化或包装受潮影响可焊性。

六、选型与使用建议

  • 若电路对温度漂移更为敏感,可考虑更低 TCR 的薄膜或金属膜电阻;若要求更高功率请选用更大封装或功率等级器件。
  • 在接近最大工作电压或高工作温度环境中,建议按厂商的功率降额曲线进行设计冗余。
  • 设计 PCB 焊盘时参考 0805 标准推荐尺寸,保证良好热传导与焊接可靠性。
  • 采购与样品确认时,可向供应商索取元件规格书与可靠性测试报告,确保满足具体应用的环境与电气要求。

如需产品规格书(datasheet)、可靠性数据或大货报价,可提供具体数量与交付地,我方可协助获取更详细资料与技术支持。

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