WMSIC Electronic Components

FOJAN FRC0402F1102TS

ModelFRC0402F1102TS
Package0402
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0402F1102TS
Type
FOJAN
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0402F1102TS
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.01g
Electronic Component
11kΩ
Electronic Component
10
Electronic Component
BM0264778011
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0204F1102TS 厚膜贴片电阻产品概述

一、产品基本定位

FRC0402F1102TS是富捷电子(FOJAN) 推出的小型化厚膜贴片电阻,采用0402封装(英制尺寸0.04×0.02英寸),针对对体积紧凑、精度稳定、低功耗需求的电子电路设计,属于工业级常规精度电阻范畴,广泛适配消费电子、汽车电子、工业控制等领域的小信号处理场景。

二、核心电气参数解析

该电阻的核心参数明确,满足多数中低频电路的基础需求:

  • 阻值与精度:标称阻值11kΩ,精度±1%(阻值偏差范围108.9kΩ~111.1kΩ),符合工业级电路对阻值稳定性的基本要求,避免信号偏移;
  • 功率与电压:额定功率62.5mW(0.0625W),额定电压50V。需注意功率优先约束:11kΩ电阻在50V下功耗约227mW(远超额定),实际电压需控制在≈26V以内(由( V=\sqrt{P×R} )计算);
  • 温度系数:±100ppm/℃(温度每变1℃,阻值变±0.01%),在宽温范围内漂移可控;
  • 工作温度:-55℃~+155℃,覆盖工业级、汽车级常规环境需求,适应高低温交替工况。

三、封装与工艺特性

  1. 0402封装优势:体积仅1.0mm×0.5mm(公制),重量轻,可显著压缩PCB布局空间,适配高密度集成设计(如智能手机主板、小型物联网模块);
  2. 厚膜工艺特点:采用丝网印刷+陶瓷基底烧结工艺,兼具成本优势与性能稳定性,抗机械应力能力优于薄膜电阻,适合批量自动化生产。

四、典型应用场景

因体积小、精度适中、宽温特性,主要应用于:

  • 消费电子:智能手机、蓝牙耳机的麦克风偏置、LED驱动限流电路;
  • 汽车电子:小型传感器(温度/压力)信号放大、车身控制模块辅助电路(155℃高温适配);
  • 工业控制:PLC模块I/O接口、小型仪器仪表分压/限流网络;
  • 物联网设备:低功耗节点电源偏置、无线模块中低频匹配网络。

五、可靠性与环境适应性

  1. 长期稳定性:电阻膜与陶瓷基底结合牢固,长期阻值漂移小,符合IEC 60115可靠性标准;
  2. 环境耐受性:耐-55℃~+155℃宽温循环,耐湿性能满足J-STD-020标准(潮湿环境无明显衰减);
  3. 抗过载能力:短时间可承受1.5倍额定功率过载(需控制时间,避免永久损伤)。

六、选型与使用注意事项

  1. 功率匹配:实际功耗需≤62.5mW,高功耗场景需换更大封装(如0603);
  2. 电压约束:实际电压需结合( V=\sqrt{P×R} )计算,避免功率超标;
  3. 焊接工艺:回流焊温度≤260℃,焊接时间≤3秒,避免热应力损坏电阻膜;
  4. 精度适配:若需0.1%高精度,需选薄膜/高精度厚膜电阻,该型号仅适配±1%需求。

该电阻以高性价比、稳定性能成为中低频小型电路的常用选型,可满足多数常规电子设备的基础电阻需求。

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