WMSIC Electronic Components

FOJAN FRC0402F2101TS

ModelFRC0402F2101TS
Package0402
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0402F2101TS
Type
FOJAN
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0402F2101TS
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.01g
Electronic Component
2.1kΩ
Electronic Component
10
Electronic Component
BM0258741078
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0402F2101TS 产品概述

一、产品简介

FRC0402F2101TS 为 FOJAN(富捷)出品的0402封装厚膜贴片电阻,标称阻值2.1kΩ,精度±1%。该器件针对高密度、轻薄化的智能终端、消费电子及工业控制类产品的表面贴装需求设计,具有稳定的电性能和良好的加工适应性。

二、主要性能参数

  • 阻值:2.1kΩ(2101)
  • 精度:±1%(F)
  • 功率:62.5mW(常温额定)
  • 工作电压:50V(最大)
  • 温度系数(TCR):±100ppm/℃
  • 工作温度范围:-55℃ ~ +155℃
  • 封装:0402(1005公制)
  • 类型:厚膜电阻(贴片)
  • 品牌:FOJAN(富捷)

三、性能特点

  • 小尺寸、低剖面,适合高密度SMT组装;
  • ±1%精度与±100ppm/℃的温漂匹配一般精密分压、滤波等应用;
  • 额定功率62.5mW,在低功耗电路中有良好稳定性;
  • 宽温区工作能力,适用于高低温环境下的可靠运行;
  • 符合常规无铅回流焊工艺,便于大批量生产。

四、典型应用

  • 手机、平板、笔记本等便携设备的阻值网络;
  • 模拟信号前端的偏置、分压与阻抗匹配;
  • 可穿戴设备、IoT节点、传感器接口以及电源管理电路等。

五、封装与包装

0402标准封装,适配高速贴片机。常用卷带(Tape & Reel)包装,满足SMT自动化贴装需求,包装规格和数量可按客户要求提供。

六、焊接与使用建议

  • 建议采用无铅回流焊,回流峰值温度按行业通用曲线控制(峰值不超过260℃,在217℃以上保持时间尽量短);
  • 工作环境温度超过70℃时建议按线性降额使用,于155℃时降至0%额定功率;
  • 避免在高湿或腐蚀性气氛中长期裸露存放,装配前做好防静电和防潮措施。

七、可靠性与检验

产品通过常规厚膜电阻可靠性测试(如高温贮存、温度循环、湿热加应力、耐焊接热冲击等),可按客户需求提供详细试验报告与出厂检验数据。

八、订购与支持

型号:FRC0402F2101TS。FOJAN提供量产供货与技术支持,如需样品、BOM替换建议或可靠性测试报告,请联系渠道工程师或客户服务以获得进一步支持。

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