WMSIC Electronic Components

FOJAN FRG0603J206 TS FRG0603J206

ModelFRG0603J206 TS
Package0603
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRG0603J206 TS
Type
FOJAN
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRG0603J206 TS
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.023g
Electronic Component
20MΩ
Electronic Component
10
Electronic Component
BM0264525371
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRG0603J206 TS厚膜贴片电阻产品概述

FRG0603J206 TS是富捷电子(FOJAN)推出的一款0603封装高阻值厚膜贴片电阻,针对小型化、高集成度电路设计,兼顾稳定性能与成本优势,广泛适配消费电子、工业控制等领域的常规应用需求。

一、产品核心定位与身份标签

该电阻属于厚膜贴片电阻系列,核心定位为小功率高阻值常规精度电阻,具体身份标签包括:

  • 品牌:FOJAN(富捷)
  • 封装规格:0603(英制,对应公制1608,尺寸1.6mm×0.8mm)
  • 阻值:20MΩ(高阻规格,区别于常规低阻)
  • 精度等级:±5%(满足多数非精密电路的参数偏差需求)
  • 功率等级:100mW(0603封装的典型额定功率)

二、关键性能参数详解

  1. 阻值与精度:20MΩ的高阻值设计,适合信号隔离、偏置电路等需要高阻抗匹配的场景;±5%的精度可覆盖一般工业控制、消费电子的常规参数偏差需求,无需额外精密校准。
  2. 功率与电压:100mW额定功率,对应0603封装的散热能力范围,在额定功率内工作时阻值稳定;75V额定工作电压,需注意电路中电压不超过此值,避免击穿或性能衰减。
  3. 温度特性:±200ppm/℃的温度系数,意味着温度每变化1℃,阻值变化约±0.02%;-55℃~+155℃的宽工作温区,可适配高温环境(如汽车电子局部高温区、工业设备高温模块)及低温户外场景。

三、封装与物理特性

采用0603贴片封装,具备以下物理优势:

  • 体积小巧:1.6mm×0.8mm的尺寸,适合高密度PCB布局(如便携设备的多层板设计);
  • 贴装适配:符合SMT表面贴装工艺标准,可通过自动化贴片机批量生产,降低人工成本;
  • 重量轻:单颗重量约0.01g,对整机重量影响极小,适合轻量化设备(如智能穿戴)。

四、典型应用场景

结合性能参数,FRG0603J206 TS主要适配以下场景:

  1. 智能穿戴设备:如智能手环、蓝牙耳机的信号偏置电路,利用高阻值实现微弱信号的稳定偏置;
  2. 工业控制模块:PLC(可编程逻辑控制器)的输入输出接口电路,作为限流或分压电阻,适配常规精度需求;
  3. 消费电子小型化电路:遥控器、小家电控制板的电源分压、信号滤波电路,兼顾体积与性能;
  4. 传感器接口电路:如温度传感器、压力传感器的阻抗匹配电阻,确保信号传输稳定;
  5. 汽车电子局部模块:车内小功率控制电路(如仪表盘背光控制),适配-55℃~+155℃的宽温区。

五、可靠性与环境适应性

  1. 厚膜电阻优势:厚膜工艺制备的电阻膜层稳定性强,抗冲击、抗振动性能优于薄膜电阻,适合有机械应力的场景(如车载设备、工业设备);
  2. 温区覆盖:-55℃+155℃的工作温度范围,超出常规工业级(-40℃+85℃),可应对极端环境;
  3. 长期可靠性:在额定参数(功率、电压、温度)内使用,寿命符合电子元器件行业标准,批量应用中故障率低。

六、品牌与品质保障

FOJAN(富捷)作为国内专业电子元器件制造商,专注电阻研发生产多年,FRG0603J206 TS通过以下品质保障:

  • 符合ISO9001质量管理体系认证;
  • 生产过程严格控制阻值偏差、温系一致性;
  • 批量供应稳定,适合OEM/ODM厂商的长期采购需求。

总结:FRG0603J206 TS是一款性价比突出的高阻值厚膜贴片电阻,兼顾小体积、宽温区与稳定性能,适配多领域常规电路需求,是小型化电子设备的理想电阻选型。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.