WMSIC Electronic Components

FOJAN FRC0603F1301TS

ModelFRC0603F1301TS
Package0603
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0603F1301TS
Type
FOJAN
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0603F1301TS
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
1.3kΩ
Electronic Component
1
Electronic Component
BM0264525061
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0603F1301TS 厚膜贴片电阻产品概述

一、产品定位与核心身份

FRC0603F1301TS是FOJAN(富捷)品牌推出的一款通用型厚膜贴片电阻,采用0603封装(英制尺寸),主打小功率、高精度、宽温适应性,适用于消费电子、工业控制、物联网终端等领域的基础电路(分压、限流、信号调节等),是电子设计中常规选型的可靠元件。

二、关键技术参数

产品核心参数严格符合行业标准,具体如下:

类别 规格参数 说明 阻值与精度 1.3kΩ ±1% 四位数代码“1301”(130×10¹=1300Ω),精度满足工业级常规需求 额定功率 100mW(0.1W) 匹配低功耗电路,避免功率过剩 工作电压 最大75V(脉冲/过压耐受) 连续工作电压需满足U≤√(P×R)≈11.4V(功率限制) 温度系数 ±100ppm/℃ 温度每变化1℃,阻值波动±0.13Ω,稳定性良好 工作温度范围 -55℃~+155℃ 覆盖工业级高低温环境 封装 0603(英制) 公制尺寸≈1.6mm×0.8mm,适合高密度布局

三、核心性能特点

  1. 高精度与稳定性:±1%精度可满足信号调理、传感器输出分压等对阻值准确的需求;±100ppm/℃温度系数在环境温度变化时(如工业现场),阻值波动可控,避免电路性能漂移。
  2. 小体积高密度:0603封装体积仅为常规插件电阻的1/10左右,适合智能手机、可穿戴设备等便携产品的高密度PCB设计,有效缩小整机尺寸。
  3. 厚膜工艺优势:采用丝网印刷+高温烧结工艺,相比薄膜电阻成本更低,抗过载能力更强(短时间可耐受1.5倍额定功率),适合批量生产。
  4. 宽温适应性:-55℃~+155℃的工作范围,可适应户外监控、车载辅助电路等高低温场景,无需额外增加散热设计。
  5. 焊接兼容性:兼容回流焊、波峰焊等自动化贴片工艺,电极设计与常规焊盘匹配,焊接良率高,适合大规模生产。

四、典型应用场景

  1. 消费电子:智能手机触控面板分压、平板电脑音频信号衰减、智能手表电池管理电路限流。
  2. 工业控制:PLC(可编程逻辑控制器)输入输出模块的信号调节、温度传感器(如PT100)输出分压、压力传感器信号放大前限流。
  3. 物联网终端:智能家居温湿度传感器模块的信号调理、智能灯控制器的低功耗分压电路、无线门禁系统的信号衰减网络。
  4. 汽车电子辅助电路:车载后视镜调节模块的电压检测、车门传感器信号滤波、车载USB充电口的限流保护。
  5. 通信设备:小型路由器电源滤波电路、无线AP的信号衰减电阻、4G模块的参考电压分压。

五、可靠性与环境适应性

  1. 长期稳定性:厚膜电阻的长期漂移(1000小时)通常≤±0.5%,满足电子设备5~10年的可靠运行需求。
  2. 耐环境测试:通过温度循环(-55℃+155℃,100次)、湿度测试(5%95%RH,无凝露),适应复杂工况。
  3. 抗机械应力:封装结构紧凑,可承受常规振动(10~2000Hz,1g),适合车载、户外设备等振动场景。

六、封装与包装规格

  • 封装尺寸:长1.60±0.15mm,宽0.80±0.15mm,厚0.45±0.10mm(公制),引脚间距0.5±0.1mm。
  • 包装方式:采用8mm卷带包装(每卷10000pcs),兼容SMT自动化贴装,便于生产线快速上料。

FRC0603F1301TS凭借高性价比、稳定性能与小体积优势,成为电子设计中基础电阻选型的常用元件,可覆盖大多数中低功耗电路的需求,是工程师降低设计成本、提升可靠性的可靠选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.