WMSIC Electronic Components

FOJAN FRC1206F0000TS

ModelFRC1206F0000TS
Package1206
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC1206F0000TS
Type
FOJAN
Minimum package
5000 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC1206F0000TS
Electronic Component
1
Package
1206
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.03g
Electronic Component
0Ω
Electronic Component
1
Electronic Component
BM0264520770
Operating Temperature
55℃~+155℃
Operating Voltage
200V
Electronic Component
±400ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC1206F0000TS 厚膜贴片0Ω电阻产品概述

一、产品定位与核心身份

FRC1206F0000TS是FOJAN(富捷) 推出的1206封装厚膜贴片0Ω电阻,属于通用型被动元器件,专为电路设计中的短路连接、跳线替代、信号路径优化等场景开发。产品兼顾“精准低阻控制”与“高环境适应性”,是工业控制、汽车电子、通信设备等领域工程师优化电路设计的核心选择。

二、核心电性能参数

该电阻基于厚膜印刷工艺制造,关键参数符合行业标准与实际应用需求:

  1. 阻值与精度:标称阻值0Ω,精度±1%——厚膜工艺实现了低阻的一致性控制,避免传统跳线的阻值离散性问题,满足电路对短路连接的精准要求;
  2. 功率与电压:额定功率250mW,最大工作电压200V——可承载常规电路的功率需求,高压场景下无击穿风险,长期工作稳定性优异;
  3. 温度特性:工作温度范围覆盖-55℃~+155℃,在全温区内阻值变化符合±1%精度要求,适配严苛环境下的持续运行。

三、封装与物理特性

  1. 封装规格:采用1206英制封装(对应公制3216,尺寸3.2mm×1.6mm),为表面贴装工艺(SMT)设计,兼容自动化生产设备,适合高密度PCB布局;
  2. 物理尺寸:典型尺寸为长3.2±0.2mm、宽1.6±0.2mm、厚0.5±0.1mm,符合IPC标准,焊接可靠性高;
  3. 终端处理:端电极采用“银钯合金基底+镍锡镀层”结构,抗硫化性能优异,可有效避免潮湿环境下的电极腐蚀,延长产品寿命。

四、典型应用场景

该电阻凭借“低阻、小体积、高可靠性”特点,广泛应用于以下场景:

  1. PCB设计跳线替代:传统跳线需打孔穿线,该电阻可直接贴装于表层,简化布线流程,提升PCB密度与生产效率;
  2. 电流检测回路校准:调试阶段作为假负载替代被测元件,验证检测电路精度,避免直接测试对被测件的损伤;
  3. EMI/EMC滤波优化:在射频/高速数字电路中,作为旁路电容串联元件,调整阻抗匹配,抑制电磁干扰;
  4. 电源模块路径优化:降低电源输出路径电阻,减少功率损耗与发热,提升转换效率;
  5. 测试治具与夹具:实现测试点短路连接,方便快速切换测试模式,提高设备调试效率。

五、可靠性与环境适应性

  1. 耐环境性能:通过湿度测试(IEC 60068-2-67)、振动测试(10g~2000Hz)、冲击测试(1500g/0.5ms),适配工业控制、汽车电子等严苛场景;
  2. 长期稳定性:额定工作条件下,阻值漂移率≤0.5%/1000小时,厚膜工艺确保了产品的抗老化能力;
  3. 环保合规:符合RoHS 2.0、REACH等国际环保标准,无铅无卤,适配绿色制造需求。

六、品牌与品质保障

FOJAN(富捷)是国内专注被动元器件研发生产的高新技术企业,拥有10+年厚膜电阻生产经验:

  1. 品质认证:通过ISO 9001质量管理体系、ISO 14001环境管理体系认证,产品一致性管控严格;
  2. 生产工艺:采用先进的厚膜印刷、高温烧结工艺,出厂前100%全检阻值与电压参数;
  3. 售后支持:提供技术咨询与样品测试服务,满足客户定制化需求。

总结

FRC1206F0000TS作为高性价比的厚膜贴片0Ω电阻,以精准参数、可靠性能与成熟工艺,覆盖工业、汽车、通信等多领域应用,是工程师优化电路设计、提升产品可靠性的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.