WMSIC Electronic Components

FOJAN FRC1206F3601TS

ModelFRC1206F3601TS
Package1206
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC1206F3601TS
Type
FOJAN
Minimum package
5000 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC1206F3601TS
Electronic Component
1
Package
1206
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.03g
Electronic Component
3.6kΩ
Electronic Component
1
Electronic Component
BM0264602989
Operating Temperature
55℃~+155℃
Operating Voltage
200V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC1206F3601TS 厚膜贴片电阻产品概述

FRC1206F3601TS是富捷(FOJAN)品牌推出的一款1206封装厚膜贴片电阻,针对常规电子电路的分压、限流、信号调理等需求设计,兼具稳定性与性价比,适配多场景应用。

一、产品基本属性与封装

该电阻属于厚膜贴片电阻类别,采用1206标准封装(英制:0.12英寸×0.06英寸,公制:3.2mm×1.6mm),兼容主流PCB设计的标准焊盘尺寸,支持自动化贴装工艺,可直接用于多数电子设备的量产环节。其核心定位为常规功率型精密电阻,既满足一般电路的阻值控制需求,又能适配宽温环境的可靠性要求。

二、核心性能参数详解

1. 阻值与精度

标称阻值为3.6kΩ(标识代码“3601”,即3.6×10³Ω),精度等级为±1%,可有效避免因阻值偏差导致的电路参数漂移,适用于对阻值一致性有一定要求的信号调理、分压网络等场景。

2. 功率与电压

额定功率为250mW(0.25W),工作电压上限为200V。在额定功率范围内,电阻可长期稳定工作;实际应用中需注意电压与功率的匹配关系(如200V电压下,最大允许电流约83μA),避免过压或过功率损坏。

3. 温度特性与工作范围

  • 温度系数(TCR):±100ppm/℃,表示温度每变化1℃,阻值变化约±0.01%,在宽温范围内保持较好的阻值稳定性;
  • 工作温度范围:-55℃~+155℃,覆盖了工业现场的低温环境、高温作业场景(如靠近热源的电子设备),满足多数常规应用的温度需求。

三、典型应用场景

FRC1206F3601TS的性能参数适配多种电子领域的基础与常规精密应用:

  1. 消费电子:手机、平板、智能家居设备中的LED限流电路、电源滤波网络、信号分压模块;
  2. 工业控制:PLC、传感器接口电路的信号调理、PLC输入输出端口的限流保护;
  3. 通信设备:路由器、交换机的电源电路、信号衰减网络、阻抗匹配模块;
  4. 汽车电子(辅助场景):车载显示屏背光电路、传感器信号预处理电路(需结合整车认证需求,本产品适配常规车载温度场景)。

四、品牌与可靠性保障

富捷(FOJAN)作为国内专业电子元器件制造商,其厚膜电阻产品采用成熟的厚膜丝网印刷工艺,确保阻值一致性与长期稳定性。产品经过以下可靠性测试:

  • 高温老化测试(+155℃下持续工作1000小时);
  • 湿度循环测试(-40℃~+85℃湿度环境下循环);
  • 无铅焊接兼容性测试(符合RoHS环保要求),适配回流焊、波峰焊等量产工艺。

五、选型与使用注意事项

  1. 功率降额:实际使用功率建议不超过额定功率的80%(即200mW),高温环境(>125℃)下需进一步降额至70%(175mW),避免阻值漂移或烧毁;
  2. 电压限制:电路工作电压不得超过200V,若存在瞬态过压(如静电、浪涌),需配合TVS管等保护元件;
  3. 焊接工艺:回流焊峰值温度控制在240~260℃,焊接时间不超过10秒;波峰焊温度不超过250℃,避免热应力损坏电阻;
  4. 温漂考量:若电路对阻值稳定性要求极高(如精密测量、医疗设备),需结合实际工作温度计算阻值变化(如+155℃时,阻值变化约±1.08%),必要时选择更低温漂的薄膜电阻。

总结

FRC1206F3601TS以稳定的性能、宽温范围与高性价比,成为电子设计中电阻选型的可靠选择,适用于多数常规电子电路的基础应用与常规精密场景,可满足量产与可靠性需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.