WMSIC Electronic Components

FOJAN FRC0603F1473TS

ModelFRC0603F1473TS
Package0603
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0603F1473TS
Type
FOJAN
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0603F1473TS
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
147kΩ
Electronic Component
1
Electronic Component
BM0264521753
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0603F1473TS 厚膜贴片电阻产品概述

一、产品基本定位

FRC0603F1473TS是FOJAN(富捷)品牌针对小型化电路设计推出的厚膜贴片电阻,采用行业通用0603封装(公制尺寸约1.6mm×0.8mm×0.5mm),属于高性价比、宽温适应性的被动元器件,可覆盖消费电子、工业控制等多领域应用需求。

二、核心参数及实际意义

该型号关键参数经过场景化优化,具体解析如下:

  1. 阻值与精度:标称阻值147kΩ,精度±1%——无需额外校准即可满足信号分压、偏置电路对阻值准确性的要求,避免因精度不足导致的电路偏差(如传感器信号放大失真)。
  2. 功率与电压:额定功率100mW,最大工作电压75V——在额定功率范围内稳定工作,75V耐压值确保高电位场景(如高压分压检测)下的绝缘可靠性,降低击穿风险。
  3. 温度特性:温度系数±100ppm/℃,工作温度-55℃~+155℃——温度每变化1℃,阻值变化约0.01%;若环境温度变化100℃,阻值漂移仅1.47kΩ(仍在±1%精度范围内),极端温度下性能稳定。
  4. 封装与工艺:0603厚膜工艺——相比薄膜电阻成本更低,且耐过载能力更强,长期工作后阻值变化小,可靠性高。

三、核心性能特点

  1. 小型化集成优势:0603封装体积紧凑,可有效节省电路板空间,适配智能手机、可穿戴设备等对尺寸要求严格的产品设计,提升电路集成度。
  2. 宽温环境适应性:-55℃~+155℃的工作范围覆盖工业级设备(如户外传感器)、汽车辅助电子(如车载USB模块)等场景,无需额外设计温度补偿电路。
  3. 高性价比与一致性:FOJAN厚膜工艺成熟,该型号批量供货一致性好,成本控制合理,适合中低端消费电子及工业控制电路的批量应用。
  4. 过载与长期可靠性:厚膜结构具备良好的耐脉冲过载能力,经过老化测试后,可保证1000小时以上的长期稳定工作,无阻值漂移或失效问题。

四、典型应用场景

  1. 消费电子:智能手机/平板的电源管理模块(充电电路分压)、音频电路(耳机输出偏置)、可穿戴设备(智能手环心率传感器偏置)。
  2. 工业控制:小型PLC输入输出接口、低功率电机驱动限流环节、工业传感器(温度/压力)信号调理电路。
  3. 汽车电子(辅助类):车载USB充电模块电压检测、仪表盘背光控制分压调节、车内传感器接口电路。
  4. 物联网设备:低功耗物联网节点电源稳压偏置、传感器节点信号放大电路。

五、品牌与质量保障

FOJAN(富捷)是国内专注被动元器件研发生产的企业,产品通过ISO9001质量管理体系认证;FRC0603F1473TS经过高低温循环、耐湿、脉冲过载等严格测试,符合RoHS环保标准,可满足不同行业的质量要求。

该型号以“小型化、宽温、高性价比”为核心优势,是多数电路设计中147kΩ±1%阻值需求的优选方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.